Search Results - "VOLANT, RICHARD" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

A Resonant Global Clock Distribution for the Cell Broadband Engine Processor

A Resonant Global Clock Distribution for the Cell Broadband Engine Processor

by Chan, S.C., Restle, P.J., Bucelot, T.J., Liberty, J.S., Weitzel, S., Keaty, J.M., Flachs, B., Volant, R., Kapusta, P., Zimmerman, J.S.
Published in IEEE journal of solid-state circuits (01.01.2009)

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Journal Article Conference Proceeding

A Resonant Global Clock Distribution for the Cell Broadband-Engine Processor

A Resonant Global Clock Distribution for the Cell Broadband-Engine Processor

by Chan, Steven, Restle, Phillip, Bucelot, Thomas, Weitzel, Stephen, Keaty, John, Liberty, John, Flachs, Brian, Volant, Richard, Kapusta, Peter, Zimmerman, Jeff
Published in 2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers (01.02.2008)

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Conference Proceeding

FORMING A PROTECTIVE LAYER ON A MOLD AND MOLD HAVING A PROTECTIVE LAYER

FORMING A PROTECTIVE LAYER ON A MOLD AND MOLD HAVING A PROTECTIVE LAYER

by KNICKERBOCKER SARAH H, JONES BRADLEY PAUL, VOLANT RICHARD PAUL
Year of Publication 13.04.2011

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Patent

OPTIMIZED ANNULAR COPPER TSV

OPTIMIZED ANNULAR COPPER TSV

by ANDRY PAUL S, IYER SUBRAMANIAN S, VOLANT RICHARD P, KINSER EMILY R, HANNON ROBERT, TSANG CORNELIA K, FAROOQ MUKTA G
Year of Publication 05.02.2014

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Patent

INTEGRATION SCHEME FOR EXTENSION OF VIA OPENING DEPTH

INTEGRATION SCHEME FOR EXTENSION OF VIA OPENING DEPTH

by JONES BRADLEY, KEI RAMONA, COLON DAVID, KNAUSS RAYMOND, WANG YUN, VOLANT RICHARD
Year of Publication 08.09.2010

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Patent

METAL-CONTAMINATION -FREE THROUGH-SUBSTRATE VIA STRUCTURE

METAL-CONTAMINATION -FREE THROUGH-SUBSTRATE VIA STRUCTURE

by VOLANT, Richard, P, FAROOQ, Mukta, G, HANNON, Robert
Year of Publication 25.11.2020

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Patent

MULTIPOSITION MICRO ELECTROMECHANICAL SWITCH

MULTIPOSITION MICRO ELECTROMECHANICAL SWITCH

by GROVES ROBERT A, JAHNES CHRISTOPHER, PETRARCA KEVIN, HERBST BRIAN, VOLANT RICHARD
Year of Publication 05.06.2002

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Patent

METHOD AND STRUCTURE OF FORMING BACKSIDE THROUGH SILICON VIA CONNECTIONS

METHOD AND STRUCTURE OF FORMING BACKSIDE THROUGH SILICON VIA CONNECTIONS

by VOLANT RICHARD P, FAROOQ MUKTA G
Year of Publication 09.04.2015

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Patent

Method and structure of forming backside through silicon via connections

Method and structure of forming backside through silicon via connections

by VOLANT RICHARD P, FAROOQ MUKTA G
Year of Publication 03.03.2015

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Patent

METHOD AND STRUCTURE OF FORMING BACKSIDE THROUGH SILICON VIA CONNECTIONS

METHOD AND STRUCTURE OF FORMING BACKSIDE THROUGH SILICON VIA CONNECTIONS

by VOLANT RICHARD P, FAROOQ MUKTA G
Year of Publication 08.05.2014

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Patent

Method and structure of forming backside through silicon via connections

Method and structure of forming backside through silicon via connections

by VOLANT RICHARD P, FAROOQ MUKTA G
Year of Publication 29.04.2014

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Patent

METHOD AND STRUCTURE OF FORMING BACKSIDE THROUGH SILICON VIA CONNECTIONS

METHOD AND STRUCTURE OF FORMING BACKSIDE THROUGH SILICON VIA CONNECTIONS

by VOLANT RICHARD P, FAROOQ MUKTA G
Year of Publication 06.02.2014

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Patent

Protected through semiconductor via (TSV)

Protected through semiconductor via (TSV)

by Petrarca Kevin S, Oakley Jennifer A, Volant Richard P, Farooq Mukta G
Year of Publication 06.06.2017

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Patent

Integrated void fill for through silicon via

Integrated void fill for through silicon via

by VOLANT RICHARD P, PETRARCA KEVIN S, FAROOQ MUKTA G
Year of Publication 04.02.2015

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Patent

METAL-CONTAMINATION -FREE THROUGH-SUBSTRATE VIA STRUCTURE

METAL-CONTAMINATION -FREE THROUGH-SUBSTRATE VIA STRUCTURE

by HANNON, ROBERT, VOLANT, RICHARD, P, FAROOQ, MUKTA, G
Year of Publication 28.01.2015

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Patent

PROTECTED THROUGH SEMICONDUCTOR VIA (TSV)

PROTECTED THROUGH SEMICONDUCTOR VIA (TSV)

by Petrarca Kevin S, Oakley Jennifer A, Volant Richard P, Farooq Mukta G
Year of Publication 06.10.2016

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Patent

Protected through semiconductor via (TSV)

Protected through semiconductor via (TSV)

by Petrarca Kevin S, Oakley Jennifer A, Volant Richard P, Farooq Mukta G
Year of Publication 26.07.2016

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Patent

Metal-contamination-free through-substrate via structure

Metal-contamination-free through-substrate via structure

by VOLANT RICHARD P, HANNON ROBERT, FAROOQ MUKTA G
Year of Publication 25.03.2014

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Patent

Protecting a mold having a substantially planar surface provided with a plurality of mold cavities

Protecting a mold having a substantially planar surface provided with a plurality of mold cavities

by VOLANT RICHARD P, JONES BRADLEY P, KNICKERBOCKER SARAH H
Year of Publication 11.03.2014

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Patent

Integrated void fill for through silicon via

Integrated void fill for through silicon via

by VOLANT RICHARD P, PETRARCA KEVIN S, FAROOQ MUKTA G
Year of Publication 21.01.2014

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Patent

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