Brookite-rich titania films made by pulsed laser deposition
Moret, Mona P., Zallen, Richard, Vijay, Dilip P., Desu, Seshu B.
Published in Thin solid films (01.05.2000)
Published in Thin solid films (01.05.2000)
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Journal Article
Novel fatigue-free layered structure ferroelectric thin films
Desu, Seshu B., Vijay, Dilip P.
Published in Materials science & engineering. B, Solid-state materials for advanced technology (01.06.1995)
Published in Materials science & engineering. B, Solid-state materials for advanced technology (01.06.1995)
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c-Axis oriented ferroelectric SrBi2(TaxNb2-x)O9 thin films
DESU, S. B, VIJAY, D. P
Published in Materials science & engineering. B, Solid-state materials for advanced technology (01.06.1995)
Published in Materials science & engineering. B, Solid-state materials for advanced technology (01.06.1995)
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Reduction of macro level stresses in copper/low-K wafers
Sun, Sey-Shing, Pallinti, Jayanthi, Vijay, Dilip, Bhatt, Hemanshu, Ying, Hong, Kao, Chiyi, Burke, Peter
Year of Publication 13.12.2011
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Year of Publication 13.12.2011
Patent
Reduction of macro level stresses in copper/low-K wafers
PALLINTI JAYANTHI, SUN SEY-SHING, BURKE PETER, BHATT HEMANSHU, KAO CHIYI, YING HONG, VIJAY DILIP
Year of Publication 13.12.2011
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Year of Publication 13.12.2011
Patent
Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing
PALLINTI JAYANTHI, LOW QWAI, SUN SEY-SHING, RANGANATHAN RAMASWAMY, BURKE PETER, BHATT HEMANSHU, KAO CHIYI, YING HONG, VIJAY DILIP
Year of Publication 12.05.2009
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Year of Publication 12.05.2009
Patent
Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing
Pallinti, Jayanthi, Vijay, Dilip, Bhatt, Hemanshu, Sun, Sey-Shing, Ying, Hong, Kao, Chiyi, Burke, Peter, Ranganathan, Ramaswamy, Low, Qwai
Year of Publication 12.05.2009
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Year of Publication 12.05.2009
Patent
Reduction of macro level stresses in copper/Low-K wafers by altering aluminum pad/passivation stack to reduce or eliminate IMC cracking in post wire bonded dies
PALLINTI JAYANTHI, SUN SEY-SHING, BURKE PETER, BHATT HEMANSHU, KAO CHIYI, YING HONG, VIJAY DILIP
Year of Publication 10.05.2007
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Year of Publication 10.05.2007
Patent