Electronic package assembly with protective encapsulant material
MEMIS, IRVING, VETTEL, GERALD MICHAEL, BONITZ, BARRY ALAN, KAPUR, KISHEN NARAIN, MCCREARY, JACK MARLYN, ELLERSON, JAMES VERNON
Year of Publication 11.06.1997
Get full text
Year of Publication 11.06.1997
Patent
Electronic package assembly with protective encapsulant material
MEMIS, IRVING, VETTEL, GERALD MICHAEL, BONITZ, BARRY ALAN, KAPUR, KISHEN NARAIN, MCCREARY, JACK MARLYN, ELLERSON, JAMES VERNON
Year of Publication 16.06.1993
Get full text
Year of Publication 16.06.1993
Patent