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"VERNON; JEAN-YVES"
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"VERNON; JEAN-YVES"
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Method and apparatus for soldering elements on the corresponding pads of a wafer, in particular a wafer having high-density integrated circuits
by
BOITEAU; JEAN-PIERRE
,
LE MEAU; MICHEL
,
VERNON
;
JEAN
-
YVES
Year of Publication
29.03.1988
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PROCEDE ET DISPOSITIF DE SOUDAGE D'ELEMENTS SUR LES PLOTS CORRESPONDANTS D'UNE PLAQUETTE TELLE QUE NOTAMMENT UNE PLAQUETTE DE CIRCUITS INTEGRES DE HAUTE DENSITE
by
MICHEL LE MEAU, JEAN-PIERRE BOITEAU ET
JEAN
-
YVES VERNON
Year of Publication
03.04.1987
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PROCEDE ET DISPOSITIF DE SOUDAGE D'ELEMENTS SUR LES PLOTS CORRESPONDANTS D'UNE PLAQUETTE TELLE QUE NOTAMMENT UNE PLAQUETTE DE CIRCUITS INTEGRES DE HAUTE DENSITE
by
MICHEL LE MEAU, JEAN-PIERRE BOITEAU ET
JEAN
-
YVES VERNON
Year of Publication
23.02.1990
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PROCESS AND DEVICE FOR WELDING ELEMENTS ON THE CORRESPONDING SPOTS OF A SUBSTRATE, SUCH AS A HIGH-DENSITY INTEGRATED-CIRCUIT SUBSTRATE
by
VERNON
,
JEAN
-
YVES
,
LE MEAU, MICHEL
,
BOITEAU, JEAN-PIERRE
Year of Publication
09.08.1989
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Process and device for welding elements on the corresponding spots of a substrate, such as a high-density integrated-circuit substrate
by
VERNON
,
JEAN
-
YVES
,
LE MEAU, MICHEL
,
BOITEAU, JEAN-PIERRE
Year of Publication
22.04.1987
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Format
Patent
5 results
5
Subject Area
chemistry
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medicine
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sciences
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Topic
basic electric elements
5 results
5
cladding or plating by soldering or welding
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5
cutting by applying heat locally, e.g. flame cutting
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5
electric solid state devices not otherwise provided for
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electricity
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general tagging of cross-sectional technologies spanning over several sections of the ipc
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French
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esp@cenet
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