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IC PACKAGE WITH MICRO LEDS
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Year of Publication 12.04.2023
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Year of Publication 23.03.2023
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PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
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Year of Publication 11.06.2024
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ELECTRONIC PACKAGING ARCHITECTURE WITH CUSTOMIZED VARIABLE METAL THICKNESS ON SAME BUILDUP LAYER
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Year of Publication 29.03.2023
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SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE
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Year of Publication 26.10.2023
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Corner guard for improved electroplated first level interconnect bump height range
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Year of Publication 03.10.2023
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ELECTRONIC PACKAGING ARCHITECTURE WITH CUSTOMIZED VARIABLE METAL THICKNESS ON SAME BUILDUP LAYER
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Year of Publication 23.03.2023
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COPPERLESS REGIONS TO CONTROL PLATING GROWTH
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Year of Publication 18.03.2021
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Year of Publication 18.03.2021
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SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE
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Year of Publication 04.02.2021
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CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BUMP HEIGHT RANGE
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Year of Publication 21.01.2021
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Year of Publication 21.01.2021
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PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
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Year of Publication 21.01.2021
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Year of Publication 21.01.2021
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