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Reflow furnace for an electronic assembly
by
WATSON; JEFFREY R
,
ROACH; STEVEN B
,
VAN
;
KIET M
Year of Publication
10.10.2000
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Patent
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Patent
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chemistry
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medicine
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sciences
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Topic
cladding or plating by soldering or welding
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cutting by applying heat locally, e.g. flame cutting
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machine tools
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metal-working not otherwise provided for
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performing operations
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soldering or unsoldering
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English
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esp@cenet
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