Search Results - "Uzoh, Cyprian E" :: K.UTB vyhledávací portál

Characterization of copper layers grown by electrochemical mechanical deposition technique

by Wang, Tony, Lindquist, Paul, Erdemli, Serkan, Basol, Erol C., Zhang, Richard, Uzoh, Cyprian E., Basol, Bulent M.
Published in Thin solid films (01.05.2005)

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Planarization Efficiency of Electrochemical Mechanical Deposition and Its Dependence on Process Parameters

by Basol, Bulent M, Erdemli, Serkan, Uzoh, Cyprian E, Wang, Tony
Published in Journal of the Electrochemical Society (01.01.2006)

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Journal Article

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METHOD FOR PLATING METAL IN SUBMICRON STRUCTURE

by PETER S LOCKE, UZOH CYPRIAN E
Year of Publication 26.02.2001

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Patent

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AN OPEN-BOTTOMED VIA LINER STRUCTURE AND METHOD FOR FABRICATING SAME

by SIMON, ANDREW H, UZOH, CYPRIAN E
Year of Publication 16.10.2000

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Patent

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DIFFUSION BARRIER OF STEPWISE COMPOSITION FOR CHIP WIRING APPLICATION

by SIMON ANDREW H, UZOH CYPRIAN E, DANIEL C EDELSTEIN
Year of Publication 15.03.2001

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Patent

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SELENIUM CONTAINING ELECTRODEPOSITION SOLUTION AND METHODS

by UZOH CYPRIAN E, AKSU SERDAR
Year of Publication 10.06.2010

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Patent

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Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same

by Uzoh, Cyprian E, Basol, Bulent M
Year of Publication 02.03.2010

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Patent

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Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same

by UZOH CYPRIAN E, BASOL BULENT M
Year of Publication 02.03.2010

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Patent

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Method to plate C4 to copper stud

by UZOH CYPRIAN E, EDELSTEIN DANIEL C
Year of Publication 17.11.2009

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Patent

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Method to plate C4 to copper stud

by Uzoh, Cyprian E, Edelstein, Daniel C
Year of Publication 17.11.2009

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Patent

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Apparatus for reduction of defects in wet processed layers

by UZOH CYPRIAN E, BASOL BULENT M
Year of Publication 17.03.2009

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Patent

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Apparatus for reduction of defects in wet processed layers

by Basol, Bulent M, Uzoh, Cyprian E
Year of Publication 17.03.2009

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Patent

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Wiring structures containing interconnected metal and wiring levels including a continuous, single crystalline or polycrystalline conductive material having one or more twin boundaries

by Uzoh, Cyprian E
Year of Publication 06.08.2002

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Patent

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Wiring structures containing interconnected metal and wiring levels including a continuous, single crystalline or polycrystalline conductive material having one or more twin boundaries

by UZOH CYPRIAN E
Year of Publication 06.08.2002

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Patent

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A method for simultaneously cleaning and annealing a metallic layer plated on a workpiece having an insulating substrate, a method for cleaning and annealing a plated workpiece, a method for altering the grain size and the texture of a metallic layer

by TALIEH, HOMAYOUN, UZOH, CYPRIAN E
Year of Publication 01.12.2005

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Patent

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WIRING STRUCTURES CONTAINING INTERCONNECTED METAL AND WIRING LEVELS INCLUDING A CONTINOUS, SINGLE CRYSTALLINE OR POLYCRYSTALLINE CONDUCTIVE MATERIAL HAVING ONE OR MORE TWIN BOUNDARIES

by UZOH, CYPRIAN E
Year of Publication 25.04.2002

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Patent

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WIRING STRUCTURES CONTAINING INTERCONNECTED METAL AND WIRING LEVELS INCLUDING A CONTINOUS, SINGLE CRYSTALLINE OR POLYCRYSTALLINE CONDUCTIVE MATERIAL HAVING ONE OR MORE TWIN BOUNDARIES

by UZOH CYPRIAN E
Year of Publication 25.04.2002

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Patent

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METHODS FOR REPAIRING DEFECTS ON A SEMICONDUCTOR SUBSTRATE

by UZOH, CYPRIAN, E
Year of Publication 21.02.2002

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Patent

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Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies

by UZOH CYPRIAN E
Year of Publication 31.01.2002

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Patent

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Enhancing copper electromigration resistance with indium and oxygen lamination

by UZOH, CYPRIAN E
Year of Publication 01.01.2002

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Patent

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