30.4 A 1Tb 3b/Cell 3D-Flash Memory in a 170+ Word-Line-Layer Technology
Higuchi, Tsutomu, Kodama, Takuyo, Kato, Koji, Fukuda, Ryo, Tokiwa, Naoya, Abe, Mitsuhiro, Takagiwa, Teruo, Shimizu, Yuki, Musha, Junji, Sakurai, Katsuaki, Sato, Jumpei, Utsumi, Tetsuaki, Yoneya, Kazuhide, Suematsu, Yasuhiro, Hashimoto, Toshifumi, Hioka, Takeshi, Yanagidaira, Kosuke, Kojima, Masatsugu, Matsuno, Junya, Shiraishi, Kei, Yamamoto, Kensuke, Hayashi, Shintaro, Hashiguchi, Tomoharu, Inuzuka, Kazuko, Sugahara, Akio, Honma, Mitsuaki, Tsunoda, Keiji, Yamamoto, Kazumasa, Sugimoto, Takahiro, Fujimura, Tomofumi, Kaneko, Mizuki, Date, Hiroki, Kobayashi, Osamu, Minamoto, Takatoshi, Tachibana, Ryoichi, Yamaguchi, Itaru, Lee, Juan, Ramachandra, Venky, Rajendra, Srinivas, Tang, Tianyu, Darne, Siddhesh, Lee, Jiwang, Li, Jason, Miwa, Toru, Yamashita, Ryuji, Sugawara, Hiroshi, Ookuma, Naoki, Kano, Masahiro, Mizukoshi, Hiroyuki, Kuniyoshi, Yuki, Watanabe, Mitsuyuki, Akiyama, Kei, Mori, Hirotoshi, Arimizu, Akira, Katano, Yoshito, Ehama, Masakazu, Maejima, Hiroshi, Hosono, Koji, Yoshihara, Masahiro
Published in 2021 IEEE International Solid- State Circuits Conference (ISSCC) (13.02.2021)
Published in 2021 IEEE International Solid- State Circuits Conference (ISSCC) (13.02.2021)
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