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Year of Publication 19.05.2020
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Design optimization for a power package by simulation
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Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
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Year of Publication 26.06.2019
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Year of Publication 26.06.2019
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Year of Publication 20.06.2019
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Year of Publication 20.06.2019
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Electronic device and method of making same
Shum, Chi Ling, Yeung, Shun Tik, Umali, Pompeo V, Leung, Chi Ho, Lam, Kan Wae
Year of Publication 28.05.2019
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Year of Publication 28.05.2019
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Semiconductor device and lead frame for semiconductor device
LIN GENWEI, YEUNG SHUN TIK, FUNKE, HANS-J ¨ 1 RGEN, YE SHUMING, UMALI POMPEO
Year of Publication 09.02.2024
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Year of Publication 09.02.2024
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