Leadframe and method for packaging semiconductor die
ROHRMOSER BERND, NOREN MARKUS BJOERN ERIK, WONG FEI-YING, TSANG PAULPANGHING, WALCZYK SVEN, BOETTCHER TIM, UMALI POMPEO, GROENHUIS ROELF ANCO JACOB, LEE CHIFAI
Year of Publication 14.11.2012
Get full text
Year of Publication 14.11.2012
Patent
REVERSIBLE SEMICONDUCTOR DIE
KAN WAE LAM, SVEN WALCYZK, THIERRY JANS, HARRIE MARTINUS MARIA HORSTINK, POMPEO V. UMALI, SHUN TIK YEUNG, CHI HO LEUNG
Year of Publication 08.05.2018
Get full text
Year of Publication 08.05.2018
Patent
Electronic component and formation method thereof
KAN WAE LAM, CHI LING SHUN, POMPEO V. UMALI, SHUN TIK YEUNG, CHI HO LEUNG
Year of Publication 01.03.2017
Get full text
Year of Publication 01.03.2017
Patent