Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors
Noriki, A., Tamai, I., Ibusuki, Y., Ukita, A., Suda, S., Takemura, K., Shimura, D., Onawa, Y., Yaegashi, H., Amano, T.
Published in 2020 European Conference on Optical Communications (ECOC) (01.12.2020)
Published in 2020 European Conference on Optical Communications (ECOC) (01.12.2020)
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Conference Proceeding
Evaluation of optical coupling characteristics for optoelectronic hybrid LSI package
Noriki, A., Amano, T., Mori, M., Sakakibara, Y., Kurata, K., Ukita, A., Kurihara, M., Takemura, K.
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Advanced devices and packaging of Si-photonics-based optical transceiver for optical interconnection
Kurata, K., Yashiki, K., Fujikata, J., Horikawa, T., Kinoshita, K., Ushida, J., Tokushima, M., Suzuki, Y., Okamoto, D., Takahashi, S., Ukita, A., Takemura, K., Ibusuki, Y., Shimizu, T., Kurihara, M., Hagihara, Y., Mogami, T., Nakamura, T.
Published in 2017 IEEE International Electron Devices Meeting (IEDM) (01.12.2017)
Published in 2017 IEEE International Electron Devices Meeting (IEDM) (01.12.2017)
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Conference Proceeding
Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics
Noriki, A., Ukita, A., Takemura, K., Suda, S., Kurosu, T, Ibusuki, Y., Tamai, I., Shimura, D., Onawa, Y., Yaegashi, H., Amano, T.
Published in 2022 European Conference on Optical Communication (ECOC) (18.09.2022)
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Published in 2022 European Conference on Optical Communication (ECOC) (18.09.2022)
Conference Proceeding
Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate
Amano, T., Noriki, A., Tamai, I., Ibusuki, Y., Ukita, A., Suda, S., Kurosu, T., Takemura, K., Aoki, T., Shimura, D., Onawa, Y., Yaegashi, H.
Published in 2021 Optical Fiber Communications Conference and Exhibition (OFC) (01.06.2021)
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Published in 2021 Optical Fiber Communications Conference and Exhibition (OFC) (01.06.2021)
Conference Proceeding
Heat-tolerant 112-Gb/s PAM4 transmission using active optical package substrate for silicon photonics co-packaging
Suda, S., Kurosu, T., Noriki, A., Tamai, I., Ibusuki, Y., Ukita, A., Takemura, K., Shimura, D., Onawa, Y., Yaegashi, H., Aoki, T., Amano, T.
Published in 2021 Opto-Electronics and Communications Conference (OECC) (03.07.2021)
Published in 2021 Opto-Electronics and Communications Conference (OECC) (03.07.2021)
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Conference Proceeding
Mirror-based silicon-photonics vertical I/O with coupling efficiency enhancement for standard single-mode fiber
Noriki, A, Tamai, I, Ibusuki, Y, Ukita, A, Suda, S, Shimura, D, Onawa, Y, Yaegashi, H, Amano, T
Published in 45th European Conference on Optical Communication (ECOC 2019) (2019)
Published in 45th European Conference on Optical Communication (ECOC 2019) (2019)
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Conference Proceeding
Practice patterns of adjuvant therapy for intermediate/high recurrence risk cervical cancer patients in Japan
Yuji Ikeda, Akiko Furusawa, Ryo Kitagawa, Aya Tokinaga, Fuminori Ito, Masayo Ukita, Hidetaka Nomura, Wataru Yamagami, Hiroshi Tanabe, Mikio Mikami, Nobuhiro Takeshima, Nobuo Yaegashi
Published in Journal of gynecologic oncology (30.05.2016)
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Published in Journal of gynecologic oncology (30.05.2016)
Journal Article
Air stripping-UASB process for the treatment of evaporator condensate from a Kraft pulp mill
Zhou, Wei-li, Qin, Xiao-peng, Yu, Jun, Imai, Tsuyoshi, Ukita, Masao
Published in Huanjing kexue (01.04.2006)
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Published in Huanjing kexue (01.04.2006)
Journal Article