A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
Iacovo, Serena, D'have, Koen, Okudur, Oguzhan Orkut, De Vos, Joeri, Uhrmann, Thomas, Plach, Thomas, Conard, Thierry, Meersschaut, Johan, Bex, Pieter, Brems, Steven, Phommahaxay, Alain, Gonzalez, Mario, Witters, Liesbeth, Beyer, Gerald, Beyne, Eric
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
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Conference Proceeding
Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Iacovo, Serena, Peng, Lan, Nagano, Fuya, Uhrmann, Thomas, Burggraf, Jurgen, Fehkuhrer, Andreas, Conard, Thierry, Inoue, Fumihiro, Kim, Soon-Wook, De Vos, Joeri, Phommahaxay, Alain, Beyne, Eric
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)
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Conference Proceeding
전자 구성요소의 생산 및 제조를 위한 방법 및 장치
LINDNER FRIEDRICH PAUL, WIMPLINGER MARKUS, BURGGRAF JURGEN, UHRMANN THOMAS
Year of Publication 19.06.2024
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Year of Publication 19.06.2024
Patent
전사 층 전사 방법 및 디바이스
POVAZAY BORIS, UHRMANN THOMAS, MOKKAPATI VENKATA RAGHAVENDRA SUBRAHMANYA SARMA
Year of Publication 10.01.2023
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Year of Publication 10.01.2023
Patent
왜곡을 보상하는 방법 및 장치
ZINNER DOMINIK, LINDNER FRIEDRICH PAUL, WAGENLEITNER THOMAS, FINGER MARTIN, ROHRINGER HARALD, WIMPLINGER MARKUS, BURGGRAF JURGEN, UHRMANN THOMAS
Year of Publication 19.06.2024
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Year of Publication 19.06.2024
Patent
Influencing factors in high precision fusion wafer bonding for monolithic integration
Uhrmann, Thomas, Kurz, Florian, Plach, Thomas, Wagenleitner, Thomas, Dragoi, Viorel, Wimplinger, Markus, Lindner, Paul
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
TEM Study on Diffusion Process of NiFe Schottky and MgO/NiFe Tunneling Diodes for Spin Injection in Silicon
Jehyun Lee, Uhrmann, Thomas, Dimopoulos, Theodoros, Bruckl, Hubert, Fidler, Josef
Published in IEEE transactions on magnetics (01.06.2010)
Published in IEEE transactions on magnetics (01.06.2010)
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Journal Article
Conference Proceeding
Monolithic IC integration key alignment aspects for high process yield
Uhrmann, Thomas, Wagenleitner, Thomas, Glinsner, Thomas, Wimplinger, Markus, Lindner, Paul
Published in 2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (01.10.2014)
Published in 2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (01.10.2014)
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Conference Proceeding
Novel Inorganic IR Release Process for High Temperature W2W and D2W Integration
Urban, Peter, Povazay, Boris, Uhrmann, Thomas, Gruber, Michael Josef, Thallner, Bernd, Wimplinger, Markus
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Collective Die Bonding: An Enabling Toolkit for Heterogeneous Integration
Burggraf, Jurgen, Uhrmann, Thomas, Pires, Mariana
Published in Meeting abstracts (Electrochemical Society) (23.11.2020)
Published in Meeting abstracts (Electrochemical Society) (23.11.2020)
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Journal Article
Wafer Bonding for Backside Illuminated Image Sensors
Matthias, Thorsten, Uhrmann, Thomas, Dragoi, Viorel, Wagenleitner, Thomas, Lindner, Paul
Published in ECS transactions (16.03.2012)
Published in ECS transactions (16.03.2012)
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Journal Article
Development of UV-curable molding materials with minimum die-shift for FOWLP/FOPLP
Schindler, Markus, Ringelstetter, Severin, Pires, Mariana, Begel, Mikhail, Kneidinger, Andrea, Kleinpotzl, Florian, Uhrmann, Thomas, Wimplinger, Markus, Brandl, Elisabeth
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism
Chancerel, Francois, Urban, Peter, Slabbekoorn, John, Halas, Simon, Bravin, Julian, Brems, Steven, Uhrmann, Thomas, Wimplinger, Markus, Phommahaxay, Alain, Beyne, Eric
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
0.5 ¼m Pitch Wafer-to-wafer Hybrid Bonding with SiCN Bonding Interface for Advanced Memory
Ma, Kai, Bekiaris, Nikolaos, Ramaswami, Sesh, Ding, Taotao, Probst, Gernot, Burggraf, Jurgen, Uhrmann, Thomas
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Heterogeneous Integration by Collective Die-To-Wafer Bonding
Uhrmann, Thomas, Burggraf, Jurgen, Eibelhuber, Martin
Published in 2018 International Wafer Level Packaging Conference (IWLPC) (01.10.2018)
Published in 2018 International Wafer Level Packaging Conference (IWLPC) (01.10.2018)
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Conference Proceeding