High Temperature Die Interconnection Approaches
Alshatnawi, Firas, Alhendi, Mohammed, Al-Haidari, Riadh A., Sivasubramony, Rajesh S., Abbara, El Mehdi, Udara Somarathna, K, Poliks, Mark D., Borgesen, Peter, Shaddock, David M., Stoffel, Nancy, Hoel, Cathleen
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Fully Additive Manufacturing of Passive Circuit Elements using Aerosol Jet Printing
Enakerakpo, Emuobosan, Alhendi, Mohammed, Khinda, Gurvinder Singh, Garakani, Behnam, Sandekelum Somarathna, K. Udara, Poliks, Mark, Gonya, Stephen, Basava, Venugopala
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Fabrication, Characterization, and Electromechanical Reliability of Stretchable Circuitry for Health Monitoring Systems
Garakani, Behnam, Somarathna, K. Udara S., Al-Haidari, Riadh, Alshatnavi, Firas W, Smilgies, Detlef-Matthias, Poliks, Mark D
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Electromechanical Characterization of a Highly Stretchable Liquid Metal Derived Conductor for Wearable Electronics
Garakani, Behnam, Somarathna, K. Udara S., Khinda, Gurvinder Singh, Sivasubramony, Rajesh Sharma, Abbara, El Mehdi, Poliks, Mark D., Srinivas, Sai, Kinzel, Chuck, Olvera-Gonzalez, Andrea, Wallans, Michael, d'Almeida, Daniel, Ronay, Mark
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Get full text
Conference Proceeding