by Sakuma, K., Toriyama, K., Noma, H., Sueoka, K., Unami, N., Mizuno, J., Shoji, S., Orii, Y.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)

by Unami, N., Noma, H., Sakuma, K., Shigetou, A., Shoji, S., Mizuno, J.
Published in 2011 International Symposium on Advanced Packaging Materials (APM) (01.10.2011)

by Sakuma, K, Mizuno, J, Nagai, N, Unami, N, Shoji, S
Published in IEEE transactions on electronics packaging manufacturing (01.07.2010)

by Okada, A., Nimura, M., Unami, N., Shigetou, A., Noma, H., Sakuma, K., Shoji, S., Mizuno, J.
Published in 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (01.05.2012)

by Okada, A., Nimura, M., Unami, N., Shigetou, A., Noma, H., Sakuma, K., Mizuno, J., Shoji, S.
Published in 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International (01.01.2012)

by SAKURAI, M, UNAMI, N, TOMISHIMA, Y, ISHIKAWA, H, HAMADA, K, KAYAKIRI, H, TANIGUCHI, K, HAMASHIMA, H, YAMAMOTO, N, MIURA, T, WASHIZUKA, K, FUJII, NAOAKI
Year of Publication 19.03.2003