Micro Cu Bump Interconnection on 3D Chip Stacking Technology
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Published in Japanese Journal of Applied Physics (01.04.2004)
Published in Japanese Journal of Applied Physics (01.04.2004)
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Ultra-high-density interconnection technology of three-dimensional packaging
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Published in Microelectronics and reliability (01.08.2003)
Published in Microelectronics and reliability (01.08.2003)
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Fabrication of High-Density Wiring Interposer for 10 GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide
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Published in Japanese Journal of Applied Physics (01.07.2004)
Published in Japanese Journal of Applied Physics (01.07.2004)
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BODY-IMPLANTED SENSED-DATA PROCESSING DEVICE, PACKAGE THEREIN, AND SYSTEM THEREWITH
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Year of Publication 02.03.2016
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
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Year of Publication 10.08.2016
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
KIM, DONG HAN, KIM, JAE CHOON, UMEMOTO MITSUO, SONG, JIK HO, CHOI, IN HO
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Year of Publication 19.07.2016
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SEMICONDUCTOR PACKAGE
KIM, DONG HAN, UMEMOTO MITSUO, KIM, JAE CHOON, SONG, JIK HO, CHOI, IN HO
Year of Publication 13.07.2016
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Year of Publication 13.07.2016
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Evaluation of the anti-ulcer drugs using image analysis technology: effect of aldioxa containing preparation on the experimental gastric ulcer in rats
Umemoto, M, Nakamura, S, Okumura, S, Sekiguchi, T, Nishihara, T, Nishimura, T, Hayashi, S
Published in Nihon yakurigaku zasshi (1989)
Published in Nihon yakurigaku zasshi (1989)
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Au Bump Interconnection in 20 µm Pitch on 3D Chip Stacking Technology
Tanida, Kazumasa, Umemoto, Mitsuo, Morifuji, Tadahiro, Kajiwara, Ryoichi, Ando, Tatsuya, Tomita, Yoshihiro, Tanaka, Naotaka, Takahashi, Kenji
Published in Japanese Journal of Applied Physics (01.10.2003)
Published in Japanese Journal of Applied Physics (01.10.2003)
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