Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock
Liu, Yang, Chen, Chuantong, Zhang, Zheng, Ueshima, Minoru, Sakamoto, Takeshi, Naoe, Takuya, Nishikawa, Hiroshi, Oda, Yukinori, Suganuma, Katsuaki
Published in Materials & design (01.12.2022)
Published in Materials & design (01.12.2022)
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Journal Article
Metastable phases of Ag–Si: amorphous Si and Ag-nodule mediated bonding
Nakayama, Koji S, Nishijima, Masahiko, Zhang, Yicheng, Chen, Chuantong, Ueshima, Minoru, Suganuma, Katsuaki
Published in Scientific reports (03.09.2024)
Published in Scientific reports (03.09.2024)
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Journal Article
Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature
Zhao, Shuaijie, Chen, Chuantong, Haga, Motoharu, Ueshima, Minoru, Hirahara, Hidetoshi, Sang, Jing, Cho, Sung hun, Sekino, Tohru, Suganuma, Katsuaki
Published in Composites. Part B, Engineering (01.04.2023)
Published in Composites. Part B, Engineering (01.04.2023)
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Journal Article
Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °C
Li, Wanli, Li, Cai-Fu, Lang, Fengpei, Jiu, Jinting, Ueshima, Minoru, Wang, Hao, Liu, Zhi-Quan, Suganuma, Katsuaki
Published in Nanoscale (01.01.2018)
Published in Nanoscale (01.01.2018)
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Journal Article
Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules
Xu, Yuxin, Qiu, Xiaoming, Li, Wangyun, Wang, Suyu, Ma, Ninshu, Ueshima, Minoru, Chen, Chuantong, Suganuma, Katsuaki
Published in Journal of materials research and technology (01.09.2023)
Published in Journal of materials research and technology (01.09.2023)
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Journal Article
Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current
Kim, Youngseok, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki, Ueshima, Minoru, Albrecht, Hans-Juergen, Wilke, Klaus, Strogies, Joerg
Published in Journal of electronic materials (01.12.2014)
Published in Journal of electronic materials (01.12.2014)
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Journal Article
Enhanced reliability of Sn–Ag–Bi–In joint under electric current stress by adding Co/Ni elements
Kim, Youngseok, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki, Ueshima, Minoru, Albrecht, Hans-Juergen, Wilke, Klaus, Strogies, Joerg
Published in Journal of materials science. Materials in electronics (01.07.2014)
Published in Journal of materials science. Materials in electronics (01.07.2014)
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Journal Article
Effect of electromigration on mechanical shock behavior in solder joints of surface mounted chip components
Kim, Youngseok, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki, Ueshima, Minoru, Albrecht, Hans-Juergen, Wilke, Klaus, Strogies, Joerg
Published in Japanese Journal of Applied Physics (01.04.2014)
Published in Japanese Journal of Applied Physics (01.04.2014)
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Journal Article
Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors
Zhao, Shuaijie, Chen, Chuantong, Haga, Motoharu, Ueshima, Minoru, Suganuma, Katsuaki
Published in Applied surface science (15.01.2023)
Published in Applied surface science (15.01.2023)
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Journal Article
Self-assembled layer as an effective way to block copper diffusion into epoxy
Zhao, Shuaijie, Chen, Chuantong, Nishijima, Masahiko, Haga, Motoharu, Ueshima, Minoru, Suzuki, Hirose, Takenaka, Hiroto, Suganuma, Katsuaki
Published in Materials letters (15.07.2024)
Published in Materials letters (15.07.2024)
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Journal Article
Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition
Li, Wangyun, Chen, Chuantong, Nishijima, Masahiko, Ueshima, Minoru, Nishikawa, Hiroshi, Suganuma, Katsuaki
Published in Materials & design (01.10.2024)
Published in Materials & design (01.10.2024)
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Journal Article
Copper diffusion into epoxy under high temperature
Zhao, Shuaijie, Chen, Chuantong, Nishijima, Masahiko, Haga, Motoharu, Ueshima, Minoru, Suzuki, Hirose, Takenaka, Hiroto, Suganuma, Katsuaki
Published in Materials letters (15.04.2024)
Published in Materials letters (15.04.2024)
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Journal Article
Effects of high temperature and high humidity on the reliability of copper/epoxy bond
Zhao, Shuaijie, Chen, Chuantong, Nishijima, Masahiko, Okumura, Rieko, Haga, Motoharu, Ueshima, Minoru, Suzuki, Hirose, Takenaka, Hiroto, Suganuma, Katsuaki
Published in Applied surface science (01.07.2024)
Published in Applied surface science (01.07.2024)
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Journal Article
Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate
Zhao, Shuaijie, Chen, Chuantong, Haga, Motoharu, Ueshima, Minoru, Suzuki, Hirose, Takenaka, Hiroto, Hirahara, Hidetoshi, Sang, Jing, Suganuma, Katsuaki
Published in Microelectronics and reliability (01.10.2023)
Published in Microelectronics and reliability (01.10.2023)
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Journal Article
Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation
Liu, Yang, Chen, Chuantong, Wang, Ye, Zhang, Zheng, Liu, Ran, Ueshima, Minoru, Ota, Ichiro, Nishikawa, Hiroshi, Nishijima, Masahiko, Nakayama, Koji S., Suganuma, Katsuaki
Published in Composites. Part B, Engineering (15.07.2024)
Published in Composites. Part B, Engineering (15.07.2024)
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Journal Article