MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER CIRCUIT SUBSTRATE
OCHI SHOZO, MATSUOKA SUSUMU, TOMEKAWA SATORU, UEDA YOJI, OKIMOTO RIKIYA
Year of Publication 05.02.2009
Get full text
Year of Publication 05.02.2009
Patent
MODULE WITH BUILT-IN ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
SHIRAISHI TSUKASA, ISHIMARU YUKIHIRO, UEDA YOJI, OKIMOTO RIKIYA, KOJIMA TOSHIYUKI
Year of Publication 15.01.2009
Get full text
Year of Publication 15.01.2009
Patent