Search Results - "UCHIDA EI" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Nickle colloidal catalyst solution for electroless nickle or nickle alloy plating and electroless nickle or nickle alloy plating method

Nickle colloidal catalyst solution for electroless nickle or nickle alloy plating and electroless nickle or nickle alloy plating method

by UCHIDA, EI, TANAKA, KAORU, KAWABATA, AI
Year of Publication 16.03.2016

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Patent

Electroless Palladium Plating from Monoaminodicarboxylic Acid Complex Bath Using Formic Acid as a Reducing Agent

Electroless Palladium Plating from Monoaminodicarboxylic Acid Complex Bath Using Formic Acid as a Reducing Agent

by NAWAFUNE, Hidemi, NAKAO, Seiichiro, MIZUMOTO, Shozo, UCHIDA, Ei, OKADA, Takashi
Published in Hyōmen gijutsu (01.12.1998)

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Journal Article

TIN OR TIN ALLOY PLATING BATH, TIN SALT SOLUTION AND ACID OR COMPLEXING AGENT SOLUTION FOR PREPARING OR CONTROLLING AND MAKING UP THE PLATING BATH, AND ELECTRICAL AND ELECTRIC COMPONENTS PREPARED BY THE USE OF THE PLATING BATH

TIN OR TIN ALLOY PLATING BATH, TIN SALT SOLUTION AND ACID OR COMPLEXING AGENT SOLUTION FOR PREPARING OR CONTROLLING AND MAKING UP THE PLATING BATH, AND ELECTRICAL AND ELECTRIC COMPONENTS PREPARED BY THE USE OF THE PLATING BATH

by YOSHIMOTO MASAKAZU, TSUJI KIYOTAKA, UCHIDA EI, OBATA KEIGO
Year of Publication 23.06.2009

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Patent

Aqueous copper colloidal catalyst solution for electroless copper plating and electroless copper plating method

Aqueous copper colloidal catalyst solution for electroless copper plating and electroless copper plating method

by UCHIDA, EI, TANAKA, KAORU, KAWABATA, AI
Year of Publication 16.08.2015

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Patent

Pretreatment solution for electroless nickel plating or electroless nickel alloy plating, and plating method

Pretreatment solution for electroless nickel plating or electroless nickel alloy plating, and plating method

by TANAKA KAORU, UCHIDA EI, KUDO TOMIO
Year of Publication 15.10.2014

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Patent

Electroless Palladium Plating from Ethylenediamine Complex Bath Using Formic Acid as a Reducing Agent

Electroless Palladium Plating from Ethylenediamine Complex Bath Using Formic Acid as a Reducing Agent

by NAWAFUNE, Hidemi, NAKAO, Seiichiro, MIZUMOTO, Shozo, UCHIDA, Ei, OKADA, Takashi
Published in Hyōmen gijutsu (01.04.1997)

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Journal Article

Non-cyanide-type gold-tin alloy plating bath

Non-cyanide-type gold-tin alloy plating bath

by UCHIDA, EI, OKADA, TAKASHI
Year of Publication 21.12.2003

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Patent

Non-cyanide-type gold-tin alloy plating bath

Non-cyanide-type gold-tin alloy plating bath

by UCHIDA EI, OKADA TAKASHI
Year of Publication 08.04.2003

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Patent

Non-cyanide-type gold-tin alloy plating bath

Non-cyanide-type gold-tin alloy plating bath

by UCHIDA EI, OKADA TAKASHI
Year of Publication 30.05.2002

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Patent

Pretreatment solution for electroless nickel plating or electroless nickel alloy plating, and plating method

Pretreatment solution for electroless nickel plating or electroless nickel alloy plating, and plating method

by KUDO, TOMIO, UCHIDA, EI, TANAKA, KAORU
Year of Publication 01.09.2013

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Patent

Pretreatment solution for electroless copper plating and electroless copper plating method

Pretreatment solution for electroless copper plating and electroless copper plating method

by KUDO, TOMIO, UCHIDA, EI, OKUNO, RYOSUKE, TANAKA, KAORU
Year of Publication 16.05.2013

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Patent

Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bath

Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bath

by Obata, Keigo, Yoshimoto, Masakazu, Tsuji, Kiyotaka, Uchida, Ei
Year of Publication 14.08.2003

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Patent

Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bath

Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bath

by YOSHIMOTO MASAKAZU, TSUJI KIYOTAKA, UCHIDA EI, OBATA KEIGO
Year of Publication 14.08.2003

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Patent

TIN-CONTAINING PLATING BATH

TIN-CONTAINING PLATING BATH

by UCHIDA, Ei, YOSHIMOTO, Masakazu, ORI, Keiji, EIKAWA, Masahiro, MASUDA, Akihiro, TSUJI, Kiyotaka, KOHINATA, Masayoshi, OBATA, Keigo
Year of Publication 02.11.2005

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Patent

Tin-containing plating bath

Tin-containing plating bath

by YOSHIMOTO MASAKAZU, TSUJI KIYOTAKA, KOHINATA MASAYOSHI, MASUDA AKIHIRO, UCHIDA EI, ORI KEIJI, OBATA KEIGO, EIKAWA MASAHIRO
Year of Publication 01.06.2006

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Patent

TIN-CONTAINING PLATING BATH

TIN-CONTAINING PLATING BATH

by ORI, KEIJI, YOSHIMOTO, MASAKAZU, UCHIDA, EI, MASUDA, AKIHIRO, EIKAWA, MASAHIRO, KOHINATA, MASAYOSHI, OBATA, KEIGO, TSUJI, KIYOTAKA
Year of Publication 05.04.2006

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Patent

Tin-containing plating bath

Tin-containing plating bath

by MASUDA AKIHIRO,KOHINATA MASAYOSHI,OBATA KEIGO,YOSHIMOTO MASAKAZU,TSUJI KIYOTAKA,UCHIDA EI,ORI KEIJI,EIKAWA MASAHIRO
Year of Publication 01.03.2006

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Patent

TIN-CONTAINING PLATING BATH

TIN-CONTAINING PLATING BATH

by YOSHIMOTO MASAKAZU, TSUJI KIYOTAKA, KOHINATA MASAYOSHI, MASUDA AKIHIRO, UCHIDA EI, ORI KEIJI, OBATA KEIGO, EIKAWA MASAHIRO
Year of Publication 20.09.2005

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Patent

Tin of tin alloy plating bath,tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath,and electrical and electric components prepared by the use of the plating bath

Tin of tin alloy plating bath,tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath,and electrical and electric components prepared by the use of the plating bath

by YOSHIMOTO, MASAKAZU, UCHIDA, EI, TSUJI, KIYOTAKA, KEIGO OBATA
Year of Publication 01.10.2008

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Patent

TWI363814B

TWI363814B

by ORI, KEIJI, YOSHIMOTO, MASAKAZU, UCHIDA, EI, MASUDA, AKIHIRO, EIKAWA, MASAHIRO, KOHINATA, MASAYOSHI, OBATA, KEIGO, TSUJI, KIYOTAKA
Year of Publication 11.05.2012

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Patent

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