Comparison of Micro-Pin-Fin and Microchannel Heat Sinks Considering Thermal-Hydraulic Performance and Manufacturability
Jasperson, B.A., Yongho Jeon, Turner, K.T., Pfefferkorn, F.E., Weilin Qu
Published in IEEE transactions on components and packaging technologies (01.03.2010)
Published in IEEE transactions on components and packaging technologies (01.03.2010)
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Journal Article
Fabrication of a high frequency piezoelectric microvalve
Li, H.Q, Roberts, D.C, Steyn, J.L, Turner, K.T, Yaglioglu, O, Hagood, N.W, Spearing, S.M, Schmidt, M.A
Published in Sensors and actuators. A. Physical. (01.03.2004)
Published in Sensors and actuators. A. Physical. (01.03.2004)
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Effect of nanotopography in direct wafer bonding: modeling and measurements
Turner, K.T., Spearing, S.M., Baylies, W.A., Robinson, M., Smythe, R.
Published in IEEE transactions on semiconductor manufacturing (01.05.2005)
Published in IEEE transactions on semiconductor manufacturing (01.05.2005)
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Journal Article
General Anisotropy Identification of Paperboard with Virtual Fields Method
Considine, J.M., Pierron, F., Turner, K.T., Vahey, D.W.
Published in Experimental mechanics (01.10.2014)
Published in Experimental mechanics (01.10.2014)
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Journal Article