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Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Challenges of Large Body FCBGA on Board Level Assembly and Reliability
Tung, Fletcher, Chung Chen, Lu, Max, Tsai, Jensen, Yu-Po Wang
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
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Year of Publication 07.12.2016
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Fabrication method of electronic package and electronic package structure
LU, CHIN-YU, TUNG, CHENG-PIAO, SU, PIN-JING, CHEN, CHUN-NAN, LAN, CHANG-YI, TANG, SHIH-WEN
Year of Publication 01.11.2016
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Year of Publication 01.11.2016
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Fabrication method of electronic package and electronic package structure
LU, CHIN YU, SU, PIN JING, LAN, CHANG YI, CHEN, CHUN NAN, TANG, SHIH WEN, TUNG, CHENG PIAO
Year of Publication 21.09.2016
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Year of Publication 21.09.2016
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BOP Design of the Substrate to Decrease Overall Cost of FC Packaging
Tung, Fletcher, Lu, Max, Lan, Albert, Huang, Vincent, Tsang, Raymond, Law, Edward
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding