Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure
Kim, Youngwoo, Park, Gapyeol, Cho, Kyungjun, Raj, Pulugurtha Markondeya, Tummala, Rao R., Kim, Joungho
Published in IEEE transactions on microwave theory and techniques (01.12.2020)
Published in IEEE transactions on microwave theory and techniques (01.12.2020)
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Journal Article
Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications
Lin, Tong-Hong, Kanno, Kimiyuki, Watanabe, Atom O., Raj, Pulugurtha Markondeya, Tummala, Rao R., Swaminathan, Madhavan, Tentzeris, Manos M.
Published in IEEE antennas and wireless propagation letters (01.11.2020)
Published in IEEE antennas and wireless propagation letters (01.11.2020)
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Journal Article
Laminated Glass-Based, Compact Inline Stepped-Impedance Resonator Bandpass Filters for 5G New Radio Modules
Ali, Muhammad, Huang, Kai-Qi, Swaminathan, Madhavan, Raj, Pulugurtha M., Tummala, Rao. R.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2021)
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Journal Article
Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test
Liu, Xi, Chen, Qiao, Sundaram, Venkatesh, Tummala, Rao R., Sitaraman, Suresh K.
Published in Microelectronics and reliability (01.01.2013)
Published in Microelectronics and reliability (01.01.2013)
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Journal Article
Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias
Watanabe, Atom O., Lin, Tong-Hong, Ali, Muhammad, Wang, Yiteng, Smet, Vanessa, Raj, Pulugurtha Markondeya, Tentzeris, Manos M., Tummala, Rao R., Swaminathan, Madhavan
Published in IEEE transactions on microwave theory and techniques (01.12.2020)
Published in IEEE transactions on microwave theory and techniques (01.12.2020)
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Journal Article
First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications
Ali, Muhammad, Liu, Fuhan, Watanabe, Atom, Raj, P. Markondeya, Sundaram, Venkatesh, Tentzeris, Manos M., Tummala, Rao R.
Published in IEEE microwave and wireless components letters (01.12.2018)
Published in IEEE microwave and wireless components letters (01.12.2018)
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Journal Article
Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer
Park, Gapyeol, Kim, Youngwoo, Cho, Kyungjun, Park, Junyong, Hwang, Insu, Kim, Jihye, Son, Kyungjune, Park, Hyunwook, Watanabe, Atom O., Raj, Pulugurtha Markondeya, Tummala, Rao R., Kim, Joungho
Published in IEEE transactions on electromagnetic compatibility (01.10.2021)
Published in IEEE transactions on electromagnetic compatibility (01.10.2021)
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Journal Article
Smaller Microvias for Packaging Interconnects by Picosecond UV Laser With a Nanometer Metal Barrier Layer: A Feasibility Study
Liu, Fuhan, Zhang, Rui, Khurana, Gaurav, Deprospo, Bartlet H., Tummala, Rao R., Swaminathan, Madhavan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2020)
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Journal Article
Cointegration of Single-Mode Waveguides and Embedded Electrical Interconnects for High-Bandwidth Communications
Zhang, Rui, Liu, Fuhan, Kathaperumal, Mohanalingam, Swaminathan, Madhavan, Tummala, Rao R.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2020)
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Journal Article
Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior
Huang, Timothy B., Sharma, Himani, Manepalli, Rahul, Kandanur, Sashi, Sundaram, Venky, Tummala, Rao R.
Published in Journal of electronic materials (01.12.2018)
Published in Journal of electronic materials (01.12.2018)
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Journal Article
Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages
Watanabe, Atom O., Ito, Hirokazu, Markondeya, Raj Pulugurtha, Tummala, Rao R., Swaminathan, Madhavan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2020)
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Journal Article
Reliability of Fine-Pitch μm-Diameter Microvias for High-Density Interconnects
Dwarakanath, Shreya, Kakutani, Takenori, Okamoto, Daichi, Raj, Pulugurtha Markondeya, Swaminathan, Madhavan, Tummala, Rao R.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
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Journal Article
Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands
Ali, Muhammad, Watanabe, Atom O., Lin, Tong-Hong, Okamoto, Daichi, Pulugurtha, Markondeya Raj, Tentzeris, Manos M., Tummala, Rao R.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
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Journal Article
Oxide composition studies of electrochemically grown tantalum oxide on sintered tantalum using XPS depth-profiling and co-relation with leakage properties
Chakraborti, Parthasarathi, Sharma, Himani, Pulugurtha, Markondeya Raj, Gandhi, Saumya, Tummala, Rao R.
Published in Journal of materials science. Materials in electronics (01.12.2017)
Published in Journal of materials science. Materials in electronics (01.12.2017)
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Journal Article
Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates
Ali, Muhammad, Watanabe, Atom, Kakutani, Takenori, Raj, Pulugurtha M., Tummala, Rao. R., Swaminathan, Madhavan
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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