Heat Distribution of Bonding Parts and Bonding Factors in Parallel Gap Bonding Process: Bonding Phenomena and Process Control on Electronic Material with Fine Size (1st Report)
Nakata, Shuji, Shin, Young-eui, Tsuruzawa, Tadashi
Published in QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY (05.02.1992)
Published in QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY (05.02.1992)
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Journal Article
Electronic component mounting structure
Ito, Atsushi, Tsuruzawa, Tadashi, Honda, Takayoshi, Sakuta, Takuya, Mikura, Hidehiro
Year of Publication 02.08.2017
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Year of Publication 02.08.2017
Patent