Investigation of Low-Temperature Cu-Cu Direct Bonding With Pt Passivation Layer in 3-D Integration
Liu, Demin, Kuo, Tsung-Yi, Liu, Yu-Wei, Hong, Zhong-Jie, Chung, Ying-Ting, Chou, Tzu-Chieh, Hu, Han-Wen, Chen, Kuan-Neng
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2021)
Get full text
Journal Article
Novel RDL Design of Wafer-Level Packaging for Signal/Power Integrity in LPDDR4 Application
Kai-Bin Wu, Tsung-Yi Kuo, Cheng-Chou Hung, Lin, Benson, I-Hsuan Peng, Yang, M.-T, Ruey-Beei Wu
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2018)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2018)
Get full text
Journal Article
Lesion of the lungs, chest wall, and ribs
Kuo, T Y, Gutman, E
Published in JAMA : the journal of the American Medical Association (18.11.1974)
Published in JAMA : the journal of the American Medical Association (18.11.1974)
Get more information
Journal Article