by Lau, John H., Chen, Gary Chang-Fu, Huang, Jones Yu-Cheng, Chou, Ricky Tsun-Sheng, Yang, Channing Cheng-Lin, Liu, Hsing-Ning, Tseng, Tzyy-Jang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2021)

by Tsun-Sheng Chou, Ricky, Lau, John H., Chang-Fu Chen, Gary, Yu-Cheng Huang, Jones, Cheng-Lin Yang, Channing, Liu, Hsing-Ning, Tseng, Tzyy-Jang
Published in Journal of microelectronics and electronic packaging (01.01.2022)

by Lau, John H, Chen, Gary Chang-Fu, Huang, Jones Yu-Cheng, Chou, Ricky Tsun-Sheng, Yang, Channing Cheng-Lin, Liu, Hsing-Ning, Tseng, Tzvy-Jang
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)