Comparative Study on Electrical Performance of eWLB, M-Series and Fan-Out Chip Last
Chih-Yi Huang, Tsun-Lung Hsieh, Po-Chih Pan, Ming-Fong Jhong, Chen-Chao Wang, Sheng-Chi Hsieh
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Design and electrical analysis for adavanced fan-out package-on-package
Po-Chih Pan, Tsun-Lung Hsieh, Chih-Yi Huang, Ming-Fong Jhong, Chen-Chao Wang
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
An Ultra Low Loss SerDes Signal Design on a FC Package Applied in 56 Gbps Networks
Yuan-Hsi Chou, Tsun-Lung Hsieh, Cheng-Yu Tsai, Chen-Chao Wang, Lih-Tyng Hwang
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Ultra High Density IO Fan-Out Design Optimization with Signal Integrity and Power Integrity
Chang, Keng Tuan, Huang, Chih-Yi, Kuo, Hung-Chun, Jhong, Ming-Fong, Hsieh, Tsun-Lung, Hung, Mi-Chun, Wang, Chen-Chao
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Heterogeneous Navigation of Vehicle by Using MIMO-OFDM System
Tsun-Lung Hsieh, Gwo-Jiun Horng, Gwo-Jia Jong
Published in 2008 Fourth International Conference on Networked Computing and Advanced Information Management (01.09.2008)
Published in 2008 Fourth International Conference on Networked Computing and Advanced Information Management (01.09.2008)
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Conference Proceeding
Ultra High Density Package Design and Electrical Analysis in High Performance Computing Application
Hsieh, Tsun-Lung, Kuo, Hung-Chun, Jhong, Ming-Fong, Huang, Chih-Yi, Wang, Chen-Chao
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
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Conference Proceeding
High density routing with electrical performance analysis using fine line package structure
Cheng-Hsun Lin, Tsun-Lung Hsieh, Chili-Yi Huang, Hung-Hsiang Cheng, Chen-Chao Wang
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
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Conference Proceeding
The Extraction of Dielectric Constant by Using the Metal Insulator Metal Capacitor for the Substrate Material
Tsun-Lung Hsieh, Gwo-Jia Jong, Chih-Wei Wu, Tsung-Lun Lee, Ya-Wen Huang
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
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Conference Proceeding
High Density IO Fan-out Design Optimization with Signal Integrity
Chang, Keng Tuan, Huang, Chih Yi, Kuo, Hung Chun, Jhong, Ming Fong, Hsieh, Tsun Lung, Hung, Mi Chun, Wang, Chen Chao
Published in 2019 IEEE CPMT Symposium Japan (ICSJ) (01.11.2019)
Published in 2019 IEEE CPMT Symposium Japan (ICSJ) (01.11.2019)
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Conference Proceeding
Semiconductor device package and a method of manufacturing the same
Hsieh, Tsun-Lung, Hung, Chih-Pin, Huang, Chih-Yi, Hu, Ian, Wang, Ming-Han
Year of Publication 31.12.2019
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Year of Publication 31.12.2019
Patent
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
HUANG, Chih-Yi, Hsieh, Tsun-Lung, HUNG, Chih-Pin, HU, Ian, WANG, Ming-Han
Year of Publication 07.11.2019
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Year of Publication 07.11.2019
Patent
The Comparison of Package Design and Electrical Analysis in Mobile Application
Hsieh, Tsun-Lung, Chou, Yuan-Hsi, Pan, Po-Chih, Huang, Chih-Yi, Jhong, Ming-Fong, Wang, Chen-Chao
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Semiconductor device package and a method of manufacturing the same
HUNG, CHIH-PIN, WANG, MING-HAN, HSIEH, TSUN-LUNG, HUANG, CHIH-YI, HU, IAN
Year of Publication 21.12.2020
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Year of Publication 21.12.2020
Patent
Semiconductor device package and a method of manufacturing the same
HU, IAN YI-QUN, HUNG, CHIH-PIN, WANG, MING-HAN, HSIEH, TSUN-LUNG, HUANG, CHIH-YI
Year of Publication 01.12.2019
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Year of Publication 01.12.2019
Patent