Development of Liquid Polyatomic Ion Beam System for Surface Modification
Takaoka, Gikan H., Tsumura, Kazumichi, Yamamoto, Tomoaki
Published in Japanese Journal of Applied Physics (01.06.2002)
Published in Japanese Journal of Applied Physics (01.06.2002)
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Journal Article
Test Structure to Assess Bump Shape Influence on Hybrid Bonding
Mizushima, Ayako, Misumi, Kei, Yasunaga, Shun, Higo, Akio, Nakane, Ryosho, Tsumura, Kazumichi, Higashi, Kazuyuki, Ochiai, Yukinori, Mita, Yoshio
Published in 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS) (15.04.2024)
Published in 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS) (15.04.2024)
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Conference Proceeding
SEMICONDUCTOR MEMORY DEVICE
KATSUMATA, Ryota, ARAI, Fumitaka, TSUMURA, Kazumichi, HIGASHI, Kazuyuki
Year of Publication 13.02.2020
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Year of Publication 13.02.2020
Patent
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
SAITO, Tomohiro, TSUMURA, Kazumichi, HIGASHI, Kazuyuki, ONOZUKA, Yutaka
Year of Publication 26.09.2024
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Year of Publication 26.09.2024
Patent
Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer Bonding Process
Nagata, Takahiro, Tsumura, Kazumichi, Nakamura, Kenro, Uchida, Kengo, Kawakita, Jin, Chikyow, Toyohiro, Higashi, Kazuyuki
Published in 2019 International 3D Systems Integration Conference (3DIC) (01.10.2019)
Published in 2019 International 3D Systems Integration Conference (3DIC) (01.10.2019)
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Conference Proceeding
Effect of N2 plasma treatment in Cu/SiO2 hybrid bonding using ultra-thin manganese film
Tsumura, Kazumichi, Uchida, Kengo, Nakamura, Kenro, Nagata, Takahiro, Higashi, Kazuyuki, Kojima, Akihiro, Shibata, Hideki
Published in 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2019)
Published in 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2019)
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Conference Proceeding