Search Results - "Tsubomatsu Yoshiaki" :: K.UTB vyhledávací portál

CIRCUIT BOARD

by FUKUTOMI NAOKI, TSUBOMATSU YOSHIAKI, NAKAYAMA HAJIME, YOSHITOMI YASUNOBU, KAITO KOICHI
Year of Publication 21.02.2003

Get full text

Patent

Loading…

SEMICONDUCTOR MOUNTING BOARD, ITS MANUFACTURING METHOD, SEMICONDUCTOR PACKAGE COMPRISING THIS BOARD, AND ITS MANUFACTURING METHOD

by TSUBOMATSU YOSHIAKI, IWASAKI YORIO, INOUE FUMIO, YAMAGUCHI REIKO, OHATA HIROTO, MORIIKE MICHIO, AWANO YASUHIKO
Year of Publication 21.09.2006

Get full text

Patent

Loading…

Substrate for mounting semiconductor chip and method for producing same

by TSUBOMATSU, YOSHIAKI, SAKURAI, TAKEHISA, HASEGAWA, KIYOSHI, EJIRI, YOSHINORI
Year of Publication 01.08.2011

Get full text

Patent

Loading…

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

by TSUBOMATSU YOSHIAKI, INOUE FUMIO, YUSA MASAMI, ICHIMURA SHIGEKI
Year of Publication 20.09.2002

Get full text

Patent

Loading…

SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD, AND SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD

by TSUBOMATSU YOSHIAKI, INOUE FUMIO, YAMAGUCHI REIKO, MORIIKE MICHIO, AWANO YASUHIKO
Year of Publication 23.08.2002

Get full text

Patent

Loading…

Semiconductor package manufacturing method and semiconductor package

by FUKUTOMI NAOKI, TSUBOMATSU YOSHIAKI, INOUE FUMIO
Year of Publication 26.02.1997

Get full text

Patent

Loading…

MANUFACTURE OF CONNECTION MEMBER

by TSUBOMATSU YOSHIAKI, OHATA HIROTO, YAMAZAKI AKIO
Year of Publication 13.09.1996

Get full text

Patent

Loading…

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, AND THE SEMICONDUCTOR PACKAGE

by FUKUTOMI NAOKI, TSUBOMATSU YOSHIAKI, INOUE FUMIO, TAGUCHI NORIYUKI, NOMURA HIROSHI, OHATA HIROTO, YAMAZAKI AKIO, HAGIWARA SHINSUKE
Year of Publication 24.11.2005

Get full text

Patent

Loading…

CHIP SUPPORTING SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

by TSUBOMATSU YOSHIAKI, INOUE FUMIO, AWANO YASUHIKO, KURITANI HIROYUKI
Year of Publication 28.09.2001

Get full text

Patent

Loading…

CHIP SUPPORT BOARD FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING IT, AND MANUFACTURING METHOD THEREOF

by TSUBOMATSU YOSHIAKI, IWASAKI YORIO, INOUE FUMIO, OHATA HIROTO, AWANO YASUHIKO
Year of Publication 10.08.2001

Get full text

Patent

Loading…

LASER BEAM MACHINING METHOD FOR HEAT RESISTANT RESIN

by TSUBOMATSU YOSHIAKI, TAKAHASHI YOSHIHIRO, YAMAZAKI AKIO
Year of Publication 17.10.1995

Get full text

Patent

Loading…

CONNECTION METHOD FOR HIGHLY FINE CIRCUIT

by TSUBOMATSU YOSHIAKI, NAKAYAMA HAJIME, HANAZONO MASANOBU
Year of Publication 11.08.1995

Get full text

Patent

Loading…

METHOD FOR STICKING METAL TO POLYIMIDE

by TSUBOMATSU YOSHIAKI, TAKAHASHI YOSHIHIRO, SAITO MANABU
Year of Publication 25.07.1995

Get full text

Patent

Loading…

MULTILAYER WIRING BOARD AND ITS MANUFACTURING METHOD

by TSUBOMATSU YOSHIAKI, MORIIKE MICHIO, NAMATAME KAZUHIKO, KAMIYAMA KENICHI, HASEGAWA KIYOSHI, TAKAI KENJI
Year of Publication 09.06.2005

Get full text

Patent

Loading…

Fabrication process of semiconductor package and semiconductor package

by TAGUCHI, NORIYUKI, HAGIWARA, SHINSUKE, INOUE, FUMIO, TSUBOMATSU, YOSHIAKI, OHHATA, HIROHITO, NOMURA, HIROSHI, FUKUTOMI, NAOKI, YAMAZAKI, TOSHIO
Year of Publication 25.05.2005

Get full text

Patent

Loading…

Fabrication process of semiconductor package and semiconductor package

by TAGUCHI, NORIYUKI, HAGIWARA, SHINSUKE, INOUE, FUMIO, TSUBOMATSU, YOSHIAKI, OHHATA, HIROHITO, NOMURA, HIROSHI, FUKUTOMI, NAOKI, YAMAZAKI, TOSHIO
Year of Publication 25.05.2005

Get full text

Patent

Loading…

Fabrication process of semiconductor package and semiconductor package

by TAGUCHI, NORIYUKI, YAMAZAHKI, TOSHIO, HAGIWARA, SHINSUKE, INOUE, FUMIO, TSUBOMATSU, YOSHIAKI, OHHATA, HIROHITO, NOMURA, HIROSHI, FUKUTOMI, NAOKI
Year of Publication 25.05.2005

Get full text

Patent