A Hox Family-Based Scoring System Predicts the Clinical Outcome of Myelodysplastic Syndromes
Yao, C.Y, Lin, C.C, Hou, H.A, Kao, C.J, Tseng, M.H, Chou, W.C, Tien, H.F
Published in Leukemia research (01.04.2017)
Published in Leukemia research (01.04.2017)
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Journal Article
Clinical Implications of the SETBP1 Mutation in Patients With Primary Myelodysplastic Syndrome and its Stability During Disease Progression
Hou, H.A, Kuo, Y.Y, Tang, J.L, Chou, W.W, Yao, M, Lai, Y.L, Lin, C.C, Chen, C.Y, Liu, C.Y, Lee, M.C, Tseng, M.H, Huang, C.F, Chiang, Y.C, Lee, F.Y, Liu, M.C, Huang, S.Y, Ko, B.S, Wu, S.J, Tsay, W, Chen, Y.C, Tien, H.F
Published in Clinical lymphoma, myeloma and leukemia (01.09.2014)
Published in Clinical lymphoma, myeloma and leukemia (01.09.2014)
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Journal Article
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Ni, S.-C., Lee, W.-H., Lo, M.Y., Tsai, C.H., Lin, C.C., Tien, F.M., Yao, M., Tang, J.L., Kuo, Y.Y., Liu, M.-C., Chuang, Y.K., Tseng, M.H., Chou, W.C., Hou, H.A., Tien, H.F.
Published in Leukemia research (01.05.2023)
Published in Leukemia research (01.05.2023)
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Journal Article
58 - A Hox Family-Based Scoring System Predicts the Clinical Outcome of Myelodysplastic Syndromes
Yao, C.Y., Lin, C.C., Hou, H.A., Kao, C.J., Tseng, M.H., Chou, W.C., Tien, H.F.
Published in Leukemia research (01.04.2017)
Published in Leukemia research (01.04.2017)
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Journal Article
C35 Terpenoids from the Bark of Calocedrus macrolepis var. formosana with Activity against Human Cancer Cell Lines
Hsieh, Chin-Lin, Tseng, Mei-Huims, Shao, Yi-Yuan, Chang, Jang-Yang, Kuo, Ching-Chuan, Chang, Chi-Yen, Kuo, Yueh-Hsiung
Published in Journal of natural products (Washington, D.C.) (01.11.2006)
Published in Journal of natural products (Washington, D.C.) (01.11.2006)
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Journal Article
Calocedimers A, B, C, and D from the Bark of Calocedrus macrolepis var. formosana
Hsieh, C.L, Shiu, L.L, Tseng, M.H, Shao, Y.Y, Kuo, Y.H
Published in Journal of natural products (Washington, D.C.) (01.04.2006)
Published in Journal of natural products (Washington, D.C.) (01.04.2006)
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Enabling 3D-IC foundry technologies for 28 nm node and beyond: through-silicon-via integration with high throughput die-to-wafer stacking
Chen, D.Y., Chiou, W.C., Chen, M.F., Wang, T.D., Ching, K.M., Tu, H.J., Wu, W.J., Yu, C.L., Yang, K.F., Chang, H.B., Tseng, M.H., Hsiao, C.W., Lu, Y.J., Hu, H.P., Lin, Y.C., Hsu, C.S., Shue, W.S., Yu, C.H.
Published in 2009 IEEE International Electron Devices Meeting (IEDM) (01.12.2009)
Published in 2009 IEEE International Electron Devices Meeting (IEDM) (01.12.2009)
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Conference Proceeding
Single-Stage Voltage Source Charge Pump Electronic Ballast with Switched-Capacitor Dimmer for Multiple Fluorescent Lamps
Tseng, M.H., Yang, H.T., Chiu, H.J., Mou, S.C.
Published in 2007 Power Conversion Conference - Nagoya (01.04.2007)
Published in 2007 Power Conversion Conference - Nagoya (01.04.2007)
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Conference Proceeding
Novel T shape structure PCM and Electrical-Thermal Characteristics
Wang, W.H., Chao, D.S., Chen, Y.C., Lee, C.M., Hsu, H.H., Chuo, Y., Tseng, M.H., Lee, M.H., Chen, W.S., Kao, M.J., Tsai, M.J.
Published in 2006 International Symposium on VLSI Technology, Systems, and Applications (01.04.2006)
Published in 2006 International Symposium on VLSI Technology, Systems, and Applications (01.04.2006)
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Conference Proceeding