Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding
De Messemaeker, Joke, Van Sever, Koen, Tsau, Yan Wen, Zhang, Boyao, Croes, Kristof, Beyne, Eric
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding
New Cu "Bulge-Out" Mechanism Supporting SubMicron Scaling of Hybrid Wafer-to-Wafer Bonding
De Messemaeker, Joke, Witters, Liesbeth, Zhang, Boyao, Tsau, Yan Wen, Fodor, Ferenc, De Vos, Joeri, Beyer, Gerald, Croes, Kristof, Beyne, Eric
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Get full text
Conference Proceeding
Simulation of Cu bulge-out by cyclic Cu surface diffusion FEM in Cu/SiCN hybrid bonding
Tsau, Yan Wen, Messemaeker, Joke De, Gonzalez, Mario, Seefeldt, Marc, Beyne, Eric, Wolf, Ingrid De
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Get full text
Conference Proceeding
Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding
Tsau, Yan Wen, De Messemaeker, Joke, Salahouelhadj, Abdellah, Gonzalez, Mario, Witters, Liesbeth, Zhang, Boyao, Seefeldt, Marc, Beyne, Eric, De Wolf, Ingrid
Published in Microelectronics and reliability (01.11.2022)
Published in Microelectronics and reliability (01.11.2022)
Get full text
Journal Article