Nanosize of zinc oxide and the effects on zinc digestibility, growth performances, immune response and serum parameters of weanling piglets
Li, Ming-Zhe, Huang, Jie-Ting, Tsai, Yi-Hao, Mao, Syuan-Yian, Fu, Chao-Ming, Lien, Tu-Fa
Published in Animal science journal (01.11.2016)
Published in Animal science journal (01.11.2016)
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Journal Article
Numerical Analysis of the Vertical Crown Displacements in Triple Adjacent Tunnels with Rock Bolts and Pipe Roofings
Chen, Shong-Loong, Tsai, Yi-Hao, Zhang, Xiao-Ling, Tang, Chao-Wei, Hsu, Yu-Yun
Published in Processes (01.10.2022)
Published in Processes (01.10.2022)
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Journal Article
The influence of oxygen content in the sputtering gas on the self-synthesis of tungsten oxide nanowires on sputter-deposited tungsten films
Chen, Chao-Hsuing, Wang, Shui-Jinn, Ko, Rong-Ming, Kuo, Yi-Cheng, Uang, Kai-Ming, Chen, Tron-Min, Liou, Bor-Wen, Tsai, Hao-Yi
Published in Nanotechnology (14.01.2006)
Published in Nanotechnology (14.01.2006)
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Journal Article
Characterization of Tungsten Carbide as Diffusion Barrier for Cu Metallization
Wang, Shui Jinn, Tsai, Hao Yi, Sun, Shi Chung
Published in Japanese Journal of Applied Physics (01.04.2001)
Published in Japanese Journal of Applied Physics (01.04.2001)
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Journal Article
ALIGNMENT MARK DESIGN FOR WAFER-LEVEL TESTING AND METHOD FORMING THE SAME
LIU CHENG YU, TENG PO YUAN, CHANG MAO YEN, WU CHENG CHIEH, PAN KUO LUNG, TSAI HAO YI, LIN CHIA WEN, CHUN SHU RONG
Year of Publication 24.01.2024
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Year of Publication 24.01.2024
Patent
Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology
Chuei-Tang Wang, Jeng-Shien Hsieh, Chang, Victor C. Y., En-Hsiang Yeh, Feng-Wei Kuo, Hsu-Hsien Chen, Chih-Hua Chen, Ron Chen, Ying-Ta Lu, Chewn-Pu Jou, Hao-Yi Tsai, Liu, C. S., Yu, Doug C. H.
Published in 2015 International 3D Systems Integration Conference (3DIC) (01.08.2015)
Published in 2015 International 3D Systems Integration Conference (3DIC) (01.08.2015)
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Conference Proceeding
RDL RDL PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY
YU CHEN HUA, LAI YU CHIA, TENG PO YUAN, PAN KUO LUNG, TSAI HAO YI, KUO TIN HAO
Year of Publication 30.12.2021
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Year of Publication 30.12.2021
Patent
STAGGERED METAL MESH ON BACKSIDE OF DEVICE DIE AND METHOD FORMING SAME
CHIANG KAI MING, HU YU HSIANG, HSIEH CHING HUA, CHUANG LIPU KRIS, LIN CHING YAO, TSENG MING HUNG, LIN CHIH WEI, TSAI WEI LUN, TSAI HAO YI, HUANG TZU SUNG, CHIANG TSUNG HSIEN, LI CHAO WEI
Year of Publication 22.05.2023
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Year of Publication 22.05.2023
Patent
PACKAGE AND METHOD OF FORMING SAME
LIU CHUNG SHI, YU CHEN HUA, WENG CHUNG MING, HSIEH CHENG CHIEH, KUO HUNG YI, TSAI HAO YI, TAI CHIH HSUAN
Year of Publication 07.06.2021
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Year of Publication 07.06.2021
Patent
IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING
LIU CHUNG SHI, YU CHEN HUA, LAI YU CHIA, HSIEH CHENG CHIEH, TSAI HAO YI, KUO TIN HAO
Year of Publication 26.03.2021
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Year of Publication 26.03.2021
Patent
3D BONDING PASSIVE DEVICES ON ACTIVE DEVICE DIES TO FORM 3D PACKAGES
YU CHEN HUA, LIU CHUNG SHI, PAN KUO LUNG, TSAI HAO YI, LAI CHI HUI, CHUN SHU RONG, KUO TIN HAO
Year of Publication 09.03.2021
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Year of Publication 09.03.2021
Patent
INTEGRATED CIRCUIT PACKAGE AND METHOD
LIU CHUNG SHI, TSAI CHI MING, TSENG MING HUNG, LIN YEN LIANG, LIN CHIH WEI, TSAI HAO YI, HO MING CHE, HUANG TZU SUNG
Year of Publication 10.12.2020
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Year of Publication 10.12.2020
Patent
DIE STACKING STRUCTURE AND METHOD FORMING SAME
YU CHEN HUA, LIU CHUNG SHI, HSIEH CHENG CHIEH, KUO HUNG YI, YU TSUNG YUAN, TSENG MING HUNG, TSAI HAO YI
Year of Publication 28.09.2021
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Year of Publication 28.09.2021
Patent