Recognition and classification of protrusion features on thin-wall parts for mold flow analysis
Lai, Jiing-Yih, Song, Pei-Pu, Hsiao, An-Sheng, Tsai, Yao-Chen, Hsu, Chia-Hsiang
Published in Engineering with computers (01.04.2021)
Published in Engineering with computers (01.04.2021)
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Journal Article
Automatic recognition and suppression of holes on mold bases for finite element applications
Song, Pei-Pu, Lai, Jiing-Yih, Tsai, Yao-Chen, Hsu, Chia-Hsiang
Published in Engineering with computers (01.07.2019)
Published in Engineering with computers (01.07.2019)
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Journal Article
Unconstrained and constrained curve fitting for reverse engineering
Ueng, Wen-Der, Lai, Jiing-Yih, Tsai, Yao-Chen
Published in International journal of advanced manufacturing technology (01.08.2007)
Published in International journal of advanced manufacturing technology (01.08.2007)
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Journal Article
Hybrid mesh generation for the thin shell of thin-shell plastic parts for mold flow analysis
Lai, Jiing-Yih, Wu, Jia-Wei, Song, Pei-Pu, Chou, Tzu-Yao, Tsai, Yao-Chen, Hsu, Chia-Hsiang
Published in Engineering with computers (01.12.2022)
Published in Engineering with computers (01.12.2022)
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Journal Article
Recognition of virtual loops on 3D CAD models based on the B-rep model
Lai, Jiing-Yih, Wang, Ming-Hsuan, You, Zi-Wei, Chiu, Yu-Kai, Hsu, Chia-Hsiang, Tsai, Yao-Chen, Huang, Chung-Yi
Published in Engineering with computers (01.10.2016)
Published in Engineering with computers (01.10.2016)
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Journal Article
Automatic reconstruction of B-spline surfaces with constrained boundaries
Lin, Kuan-Yuan, Huang, Chung-Yi, Lai, Jiing-Yih, Tsai, Yao-Chen, Ueng, Wen-Der
Published in Computers & industrial engineering (01.02.2012)
Published in Computers & industrial engineering (01.02.2012)
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Journal Article
Three dimensional auto meshing flexibility for SiP package CAE molding simulation
Kuo-Cheng Li, Yao-Chen Tsai, Chih-Chung Hsu, Chao-Tsai Huang
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
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Conference Proceeding
Maintaining color fidelity for dual-shot HDR imaging
Chingwei Yeh, Chen-Yao Tsai, Tay-Jyi Lin, Juin-In Guo
Published in 2014 IEEE International Conference on Consumer Electronics - Taiwan (01.05.2014)
Published in 2014 IEEE International Conference on Consumer Electronics - Taiwan (01.05.2014)
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Conference Proceeding
Decomposition of protrusion features on thin-shell parts for mold flow analysis
Song, Pei-Pu, Putrayudanto, Pradiktio, Wu, Tien-Yu, Lai, Jiing-Yih, Tsai, Yao-Chen, Wang, Ming-Hsuan, Hsu, Chia-Hsiang
Published in Engineering with computers (01.08.2023)
Published in Engineering with computers (01.08.2023)
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Journal Article
On the Development of Virtual Inner Loops for Feature Recognition
Wang, Ming Hsuan, Lai, Jiing Yih, Chiu, Yu Kai, Hsu, Chia Hsiang, Tsai, Yao Chen, Huang, Chung Yi
Published in Key Engineering Materials (23.07.2015)
Published in Key Engineering Materials (23.07.2015)
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Journal Article
On the Development of Blend Faces and Holes Recognition Algorithm for CAE Applications
You, Zi Wei, Wang, Ming Hsuan, Lai, Jiing Yih, Huang, Chung Yi, Chiu, Yu Kai, Hsu, Chia Hsiang, Tsai, Yao Chen
Published in Key Engineering Materials (23.07.2015)
Published in Key Engineering Materials (23.07.2015)
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Journal Article