LDoS Attacks Detection for ICPS NB-IoTs Environment via SE-Based CNN
Cho, Hsin-Hung, Tsai, Min-Yan, Zeng, Jiang-Yi, Yu, Chia-Mu, Chao, Han-Chieh, You, Ilsun
Published in IEEE systems journal (01.12.2023)
Published in IEEE systems journal (01.12.2023)
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Journal Article
Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study
Chiu, Meng-Chun, Tsai, Min-Yan, Wang, Shan-Bo, Lin, Yung-Sheng, Liang, Chien-Lung
Published in Surface & coatings technology (30.05.2024)
Published in Surface & coatings technology (30.05.2024)
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Journal Article
Effective Adversarial Examples Identification of Credit Card Transactions
Tsai, Min-Yan, Cho, Hsin-Hung, Yu, Chia-Mu, Chang, Yao-Chung, Chao, Han-Chieh
Published in IEEE intelligent systems (01.07.2024)
Published in IEEE intelligent systems (01.07.2024)
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Journal Article
An Electromigration Study of Cu Pillar Interconnects in Flip-chip QFN Packaging under Extreme Conditions for High-power Applications
Tsai, Min-Yan, Kao, Chin-Li, Wang, Shan-Bo, Lin, Yung-Sheng, Chiu, Meng-Chun, Liang, Chien-Lung
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Void Migration Kinetics in Fine Line Cu RDL under Electric Current Stressing and the Improvement of Electromigration Reliability by Polyimide Passivation
Huang, Yen-Cheng, Tsai, Min-Yan, Lin, Ting-Chun, Lin, Yung-Sheng, Wang, Chen-Chao, Hung, Chih-Pin, Lin, Kwang-Lung
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Direct Observation of Void Nucleation and Growth in a 2-µm-Wide Cu Redistribution Line During In Situ Electromigration
Liang, Chien-Lung, Lin, Yung-Sheng, Tsai, Min-Yan, Chiu, Meng-Chun, Wang, Shan-Bo, Hung, Chih-Pin, Lin, Kwang-Lung
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
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Conference Proceeding
A Smart IoT System for Waste Management
Chen, Whai-En, Wang, Yu-Huei, Huang, Po-Chuan, Huang, Yu-Yun, Tsai, Min-Yan
Published in 2018 1st International Cognitive Cities Conference (IC3) (01.08.2018)
Published in 2018 1st International Cognitive Cities Conference (IC3) (01.08.2018)
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Conference Proceeding
The Dynamic Behavior of Electromigration in a Novel Cu Tall Pillar/Cu Via Interconnect for Fan-out Packaging
Liang, Chien-Lung, Tsai, Min-Yan, Lin, Yung-Sheng, Lin, I-Ting, Yang, Sheng-Wen, Huang, Min-Lung, Fang, Jen-Kuang, Lin, Kwang-Lung
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
High efficiency colored solar cell and manufacturing method thereof
CHEN, TUNG-WEN, HSIEH, YIUN, PENG, CHIOU-SHIAN, HSU, JUI-TING, LIN, MINGUN, LIN, YI-JUN, TSAI, YAN-MIN, YOU, ZHEN-BO, JENQ, HORN, CHANG, CHI-TUNG
Year of Publication 16.05.2012
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Year of Publication 16.05.2012
Patent
HIGH EFFICIENCY COLORED SOLAR CELL AND MANUFACTURING METHOD THEREOF
YOU ZHEN-BO, PENG CHIOU-SHIAN, HSIEH YIUN, LIN MINGUN, CHEN TUNG-WEN, LIN YI-JUN, HSU JUI-TING, JENQ HORN, TSAI YAN-MIN, CHANG CHI-TUNG
Year of Publication 07.10.2010
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Year of Publication 07.10.2010
Patent
High efficiency colored solar cell and manufacturing method thereof
CHEN, TUNG-WEN, HSIEH, YIUN, PENG, CHIOU-SHIAN, HSU, JUI-TING, LIN, MINGUN, LIN, YI-JUN, TSAI, YAN-MIN, YOU, ZHEN-BO, JENQ, HORN, CHANG, CHI-TUNG
Year of Publication 06.10.2010
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Year of Publication 06.10.2010
Patent
High efficeency colored solar cell and manufacturing method thereof
HSIEH, YIUN, PENG, CHIOU-SHIAN, HSU, JUI-TING, LIN, MINGUN, LIN, YI-JUN, TSAI, YAN-MIN, JENQ, HORN
Year of Publication 16.10.2010
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Year of Publication 16.10.2010
Patent