GPGPU-Based ATPG System: Myth or Reality?
Lai, Liyang, Tsai, Kun-Han, Li, Huawei
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.01.2020)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.01.2020)
Get full text
Journal Article
Oscillation-Based Prebond TSV Test
Li-Ren Huang, Shi-Yu Huang, Sunter, Stephen, Kun-Han Tsai, Wu-Tung Cheng
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.09.2013)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.09.2013)
Get full text
Journal Article
Pulse-Vanishing Test for Interposers Wires in 2.5-D IC
Huang, Shi-Yu, Lee, Jeo-Yen, Tsai, Kun-Han, Cheng, Wu-Tung
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.08.2014)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.08.2014)
Get full text
Journal Article
Diagnosis of Intermittent Scan Chain Faults Through a Multistage Neural Network Reasoning Process
Chern, Mason, Lee, Shih-Wei, Huang, Shi-Yu, Huang, Yu, Veda, Gaurav, Tsai, Kun-Han, Cheng, Wu-Tung
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.10.2020)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.10.2020)
Get full text
Journal Article
Timing-Aware Multiple-Delay-Fault Diagnosis
Mehta, V.J., Marek-Sadowska, M., Kun-Han Tsai, Rajski, J.
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.02.2009)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.02.2009)
Get full text
Journal Article
Nonintrusive On-Line Transition-Time Binning and Timing Failure Threat Detection for Die-to-Die Interconnects
Huang, Shi-Yu, Tsai, Meng-Ting, Li, Hua-Xuan, Zeng, Zeng-Fu, Tsai, Kun-Han Hans, Cheng, Wu-Tung
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.12.2015)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.12.2015)
Get full text
Journal Article
Parametric Delay Test of Post-Bond Through-Silicon Vias in 3-D ICs via Variable Output Thresholding Analysis
Yu-Hsiang Lin, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng, Sunter, S., Yung-Fa Chou, Ding-Ming Kwai
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.05.2013)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.05.2013)
Get full text
Journal Article
Test Coverage Analysis for Designs with Timing Exceptions
Kun-Han Tsai, Gopalakrishnan, Srinivasan
Published in 2017 IEEE 26th Asian Test Symposium (ATS) (01.11.2017)
Published in 2017 IEEE 26th Asian Test Symposium (ATS) (01.11.2017)
Get full text
Conference Proceeding
Timing-Aware ATPG for High Quality At-speed Testing of Small Delay Defects
Xijiang Lin, Kun-Han Tsai, Chen Wang, Kassab, M., Rajski, J., Kobayashi, T., Klingenberg, R., Sato, Y., Hamada, S., Aikyo, T.
Published in 2006 15th Asian Test Symposium (01.11.2006)
Published in 2006 15th Asian Test Symposium (01.11.2006)
Get full text
Conference Proceeding
Improving the Resolution of Single-Delay-Fault Diagnosis
Mehta, V.J., Marek-Sadowska, M., Kun-Han Tsai, Rajski, J.
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.05.2008)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.05.2008)
Get full text
Journal Article
Small delay testing for TSVs in 3-D ICs
Huang, Shi-Yu, Lin, Yu-Hsiang, Tsai, Kun-Han (Hans), Cheng, Wu-Tung, Sunter, Stephen, Chou, Yung-Fa, Kwai, Ding-Ming
Published in DAC Design Automation Conference 2012 (03.06.2012)
Published in DAC Design Automation Conference 2012 (03.06.2012)
Get full text
Conference Proceeding
Design rule check on the clock gating logic for testability and beyond
Get full text
Conference Proceeding
Monitoring the delay of long interconnects via distributed TDC
Meng-Ting Tsai, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng
Published in 2015 IEEE International Test Conference (ITC) (01.10.2015)
Published in 2015 IEEE International Test Conference (ITC) (01.10.2015)
Get full text
Conference Proceeding
Delay testing and characterization of post-bond interposer wires in 2.5-D ICs
Shi-Yu Huang, Li-Ren Huang, Kun-Han Tsai, Wu-Tung Cheng
Published in 2013 IEEE International Test Conference (ITC) (01.09.2013)
Published in 2013 IEEE International Test Conference (ITC) (01.09.2013)
Get full text
Conference Proceeding