Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology
Kwon, Woon-Seong, Kim, Myongseob, Chang, Jonathan, Ramalingam, Suresh, Madden, Liam, Tsai, Genie, Tseng, Stephen, Lai, J.Y., Lu, Terren, Chiu, Steve
Published in Journal of microelectronics and electronic packaging (01.08.2015)
Published in Journal of microelectronics and electronic packaging (01.08.2015)
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Journal Article
Three dimensional interconnects with through silicon vias and electroplating solder microbumps
Tsai, Genie, Chen, S, Chien-Feng Chan, Chun-Chieh Chao, Chi-Hsin Chiu, Chiu, S, Chen, C
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
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Conference Proceeding
A study of thin wafer handling in 3D-IC applications
Chien-Feng Chan, Jeng-Yu Feng, Chun-Chieh Yang, Chuang, Tim, Hsieh, Kidd, Huang, Brain, Tsai, Genie, Lee, Eve, Lee, Henry, Chen, Scott, Chun-Hung Lu, Chun-Chieh Chao, Chi-Hsin Chiu, Chiu, Steve, Chen, Carl
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
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Conference Proceeding
REFRIGERACION DE UNA BANDA DE UN SEGMENTO DE LA TOBERA DE UNA TURBINA
GLEDHILL, MARK DOUGLAS, CURRIN, AUREEN CYR, DEMERS, DANIEL EDWARD, TSAI, GENE CHEN-FU
Year of Publication 16.05.2007
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Year of Publication 16.05.2007
Patent