Process integration of a direct-on-metal, non-etchback, /spl kappa/=2.5 spin-on polymer for the 0.18 /spl mu/m CMOS technology node
Sum, J.C., Ray, G.W., Ma, S., Kavari, R., MacInnes, L.M., Treadwell, C.A., Dunne, J., Hacker, N.P., Figge, L.K., Hendricks, N.
Published in Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) (1999)
Published in Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) (1999)
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