Effect of deposition temperature on mechanical properties of nanotwinned Cu fabricated by rotary electroplating
Cheng, Hsiang-Yuan, Tran, Dinh-Phuc, Tu, K.N., Chen, Chih
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.04.2021)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.04.2021)
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Journal Article
Electrodeposition of slanted nanotwinned Cu foils with high strength and ductility
Tran, Dinh-Phuc, Chen, Kuan-Ju, Tu, K.N., Chen, Chih, Chen, Yao-Tsung, Chung, Stream
Published in Electrochimica acta (01.09.2021)
Published in Electrochimica acta (01.09.2021)
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Mechanical strengthening of nanotwinned Cu films with Ag solid solution
Lee, Kang-Ping, Tran, Dinh-Phuc, Chen, Fu-Chian, Hsu, Wei-You, Lin, Yi-Quan, Liu, Hung-Che, Chen, Chih
Published in Materials letters (15.04.2022)
Published in Materials letters (15.04.2022)
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Journal Article
Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling
Shie, Kai-Cheng, Hsu, Po-Ning, Li, Yu-Jin, Tran, Dinh-Phuc, Chen, Chih
Published in Materials (24.09.2021)
Published in Materials (24.09.2021)
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Journal Article
Failures of Cu-Cu Joints under Temperature Cycling Tests
Hsu, Po-Ning, Shie, Kai-Cheng, Tran, Dinh-Phuc, Tsou, Nien-Ti, Chen, Chih
Published in Materials (15.07.2022)
Published in Materials (15.07.2022)
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Journal Article
Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces
Ong, Jia-Juen, Chiu, Wei-Lan, Lee, Ou-Hsiang, Chiang, Chia-Wen, Chang, Hsiang-Hung, Wang, Chin-Hung, Shie, Kai-Cheng, Yang, Shih-Chi, Tran, Dinh-Phuc, Tu, King-Ning, Chen, Chih
Published in Materials (03.03.2022)
Published in Materials (03.03.2022)
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Journal Article
Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films
Lin, Po-Fan, Tran, Dinh-Phuc, Liu, Hung-Che, Li, Yi-Yi, Chen, Chih
Published in Materials (26.01.2022)
Published in Materials (26.01.2022)
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Journal Article
Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly -Oriented Nanotwinned Cu
Ong, Jia-Juen, Tran, Dinh-Phuc, Yang, Shih-Chi, Shie, Kai-Cheng, Chen, Chih
Published in Metals (Basel ) (01.11.2021)
Published in Metals (Basel ) (01.11.2021)
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Journal Article
Electroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bonding
Tseng, Hsiang-Hou, Lan, Man-Chi, Hsu, Wei-You, Ong, Jia-Juen, Tran, Dinh-Phuc, Chen, Chih
Published in Journal of materials research and technology (01.11.2023)
Published in Journal of materials research and technology (01.11.2023)
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Journal Article
Effect of oxidation on electromigration in 2-µm Cu redistribution lines capped with polyimide
Tseng, I-Hsin, Hsu, Po-Ning, Hsu, Wei-You, Tran, Dinh-Phuc, Lin, Benson Tsu-Hung, Chang, Chia-Cheng, Tu, K.N., Chen, Chih
Published in Results in physics (01.12.2021)
Published in Results in physics (01.12.2021)
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