Development of Liquid Photoresist for IMS (Injection Molded Solder) with High Thermal Stability
Mukawa, Jun, Takahashi, Seiichirou, Kobata, Chihiro, Ohkita, Kenzo, Kusumoto, Shiro, Hasegawa, Koichi, Aoki, Toyohiro, Nakamura, Eiji, Hisada, Takashi, Mori, Hiroyuki, Orii, Yasumitsu
Published in Journal of Photopolymer Science and Technology (01.01.2016)
Published in Journal of Photopolymer Science and Technology (01.01.2016)
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Journal Article
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
Aoki, Toyohiro, Sakuma, Katsuyuki, Mori, Hiroyuki, Nakamura, Koki, Hisada, Takashi
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
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Conference Proceeding
Development of Liquid Photoresist for IMS (Injection Molded Solder) with High Thermal Stability
Mukawa, Jun, Takahashi, Seiichirou, Kobata, Chihiro, Ohkita, Kenzo, Kusumoto, Shiro, Hasegawa, Koichi, Aoki, Toyohiro, Nakamura, Eiji, Hisada, Takashi, Mori, Hiroyuki, Orii, Yasumitsu
Published in Journal of photopolymer science and technology (2016)
Published in Journal of photopolymer science and technology (2016)
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Journal Article
Energy-Efficient 1060-nm Optical Link Operating up to 28 Gb/s
Heroux, Jean Benoit, Kise, Tomufumi, Funabashi, Masaki, Aoki, Toyohiro, Schow, Clint L., Rylyakov, Alexander V., Nakagawa, Shigeru
Published in Journal of lightwave technology (15.02.2015)
Published in Journal of lightwave technology (15.02.2015)
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Journal Article
Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
Kohara, Sayuri, Aoki, Toyohiro, Marushima, Chinami, Taylor, Christine, Sueoka, Kuniaki, Hisada, Takashi
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
DC and RF Performance of 50 nm Gate Pseudomorphic In 0.7 Ga 0.3 As/In 0.52 Al 0.48 As High Electron Mobility Transistors Grown on (411)A-Oriented InP Substrates by Molecular-Beam Epitaxy
Masataka Higashiwaki, Masataka Higashiwaki, Takahiro Kitada, Takahiro Kitada, Toyohiro Aoki, Toyohiro Aoki, Satoshi Shimomura, Satoshi Shimomura, Yoshimi Yamashita, Yoshimi Yamashita, Akira Endoh, Akira Endoh, Kohki Hikosaka, Kohki Hikosaka, Takashi Mimura, Takashi Mimura, Toshiaki Matsui, Toshiaki Matsui, Satoshi Hiyamizu, Satoshi Hiyamizu
Published in Japanese Journal of Applied Physics (01.07.2000)
Published in Japanese Journal of Applied Physics (01.07.2000)
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Journal Article
DC AND RF PERFORMANCE OF 50 nm GATE PSEUDOMORPHIC In0.7Ga0.3As/In0.52Al0.48As HIGH ELECTRON MOBILITY TRANSISTORS GROWN ON (411)A-ORIENTED InP SUBSTRATES BY MOLECULAR-BEAM EPITAXY
Higashiwaki, M, Kitada, T, Aoki, T, Shimomura, S, Yamashita, Y, Endoh, A
Published in Jpn.J.Appl.Phys ,Part 2. Vol. 39, no. 7B, pp. L720-L722. 2000 (2000)
Published in Jpn.J.Appl.Phys ,Part 2. Vol. 39, no. 7B, pp. L720-L722. 2000 (2000)
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Journal Article
Flip Chip Joining with Injection Molded Solder Technology
Hisada, Takashi, Aoki, Toyohiro
Published in 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (07.03.2023)
Published in 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (07.03.2023)
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Conference Proceeding
Implementation challenges for scalable neuromorphic computing
Yamamichi, Shintaro, Horibe, Akihiro, Aoki, Toyohiro, Hosokawa, Kohji, Hisada, Takashi, Mori, Hiroyuki
Published in 2017 Symposium on VLSI Technology (01.06.2017)
Published in 2017 Symposium on VLSI Technology (01.06.2017)
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Conference Proceeding
Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar
Hisada, Takashi, Kohara, Sayuri, Marushima, Chinami, Aoki, Toyohiro
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
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Conference Proceeding
CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration
Miyazawa, Risa, Marushima, Chinami, Aoki, Toyohiro, Horibe, Akihiro, Hisada, Takashi
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
Sakuma, Katsuyuki, Bonilla, Griselda, McHerron, Dale, Aoki, Toyohiro, Kastberg, Russell, Pomerantz, Glenn, Bunt, Jay, Wassick, Tom
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding