Cooling Heat Sinks by Natural and Forced Convection in Microelectronic Packages: Numerical Modeling and Experimental Thermal Studies
Souare, Papa Momar, Kabirou Toure, Mamadou, Foisy, Benoit, Duchesne, Eric, Sylvestre, Julien
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
Accurate Modeling of Forced Convection Cooling for Microelectronic Packages: Numerical and Experimental Thermal Studies
Toure, Mamadou Kabirou, Souare, Papa Momar, Foisy, Benoit, Duchesne, Eric, Sylvestre, Julien
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
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Conference Proceeding
Study of underfill corner cracks by the confocal-DIC and phantom-nodes methods
Yang, Ying, Toure, Mamadou Kabirou, Souare, Papa Momar, Duchesne, Eric, Sylvestre, Julien
Published in Microelectronics and reliability (01.01.2022)
Published in Microelectronics and reliability (01.01.2022)
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Journal Article
CFD-based iterative methodology for modeling natural convection in microelectronic packages
Toure, Mamadou Kabirou, Momar Souare, Papa, Allard, Stephanie, Foisy, Benoit, Duchesne, Eric, Sylvestre, Julien
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
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Conference Proceeding
High Precision Numerical and Experimental Thermal Studies of Microelectronic Packages in Still Air Chamber Tests
Souare, Papa Momar, Toure, Mamadou Kabirou, Allard, Stephanie, Foisy, Benoit, Borzou, Bijan, Duchesne, Eric, Sylvestre, Julien
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding