by Shih, Meng-Kai, Chen, Shi-Jie, Lin, I. Hung, Lou, Bai-Yao, Ni, Tom
Published in Journal of electronic materials (02.10.2024)

by Liu, Chia-Hao, Lu, Ren-Kai, Chung, Hsien, Lwo, Ben-Je, Ni, Tom, Pan, Alice
Published in International Journal of Integrated Engineering (29.11.2022)

by Li, Guorong, Zhao, Kui, Yan, Lijun, Hiroshi, Iizuka, Liu, Shenjian, Tom, Ni, Zhang, Xing
Published in Beijing da xue xue bao (01.01.2019)

by Tseng, Kun-Fu, Huang, Tzu-Yen, Lwo, Ben-Je, Ni, Tom
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2019)

by Ben-Je Lwo, Chia-Liang Teng, Kun-Fu Tseng, Ni, Tom, Lu, Shirley
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2017)

by 李国荣, 赵馗, 严利均, Hiroshi Iizuka, 刘身健, 倪图强, 张兴
Published in 北京大学学报（自然科学版） (20.11.2019)

by Zhou, Zhongyue, Xie, Mingfeng, Tang, Tang, Zhang, Yijun, Yuan, Tao, Qi, Fei, Ni, Tom, Qian, Xueyu
Published in Plasma chemistry and plasma processing (01.06.2010)

by Lin, I-Hung, Lin, Cheng-Chen, Pan, Ying-Chieh, Lwo, Ben-Je, Ni, Tom
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)

by Chung, Hsien, Li, Yu-Jyun, Lwo, Ben-Je, Ni, Tom
Published in 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.12.2021)

by Lin, I-Hung, Chen, Yu-Tai, Huang, Ji-Ting, Lu, Hsiang-Hua, Pan, Ying-Chieh, Wang, Chien-Hui, Ni, Tom
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)

by Lo, Wei-Chen, Lwo, Ben-Je, Chung, Hsien, Ni, Tom, Lu, Shirley
Published in 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2019)

by Shenghua Zhu, Xingjian Chen, Ni, Tom, Xiaoming He
Published in 2016 China Semiconductor Technology International Conference (CSTIC) (01.03.2016)

by Ni, Tom, Su, Scott, Cheng, Anna, Lu, Shirley, Su, Teddy, Chang, C. C., Fang, David, Tai, Johnson
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)

by Ben-Je Lwo, Chia-Liang Teng, Ni, Tom, Lu, Shirley
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)

by Ni, Tom, Lien, Lisa, Chen, Nuno, Huang, K. Y., Chang, Winson, Chung, K. W., Huang, Wesley, Wang, Roger, Chen, M. J., Liu, Alex, Hsu, S. C., Lin, James, Chang, C. C., Tai, Johnson
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)

by TOM NI
Year of Publication 21.03.2011

by Gopalan, Ramesh, Srivatsan, Sridharan, Ramanujam, Katgenhalli Y, Ni, Tom, Chiang, Conan
Year of Publication 06.04.2010

by Gopalan, Ramesh, Srivatsan, Sridharan, Ramanujam, Katgenhalli Y, Ni, Tom, Chiang, Conan
Year of Publication 19.08.2008

by TOM NI, JINYUAN CHEN, ZHOU, XU-SHENG, FU, YUE-HONG, XU, CHAO-YANG, QING QIAN
Year of Publication 11.04.2009

by NI, TOM
Year of Publication 11.12.2015