Mechanism of Mechanical and Chemical Polishing in Low Dielectric Constant Plasma-Enhanced Chemical Vapor Deposition SiOC Layer from Hexamethyldisiloxane
Hara, Tohru, Togoh, Fumiaki, Kurosu, Toshiaki, Sakamoto, Keiichi, Shioya, Yoshimi, Ishimaru, Tomomi, Doy, Toshiro K.
Published in Electrochemical and solid-state letters (01.08.2001)
Published in Electrochemical and solid-state letters (01.08.2001)
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