High thermal performance ICP die attach process design and development for LQFP-EP
Lim Fui Yee, Khoo Ly Hoon, Tiu Kong Bee, Yow Kai Yun
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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