Scaling behavior of EEG amplitude and frequency time series across sleep stages
Kantelhardt, Jan W., Tismer, Sebastian, Gans, Fabian, Schumann, Aicko Y., Penzel, Thomas
Published in Europhysics letters (01.10.2015)
Published in Europhysics letters (01.10.2015)
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Journal Article
Fluctuations in Wikipedia access-rate and edit-event data
Kämpf, Mirko, Tismer, Sebastian, Kantelhardt, Jan W., Muchnik, Lev
Published in Physica A (01.12.2012)
Published in Physica A (01.12.2012)
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Journal Article
Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy
Naumann, Falk, Brand, Sebastian, Bernasch, Michael, Tismer, Sebastian, Czurratis, Peter, Wünsch, Dirk, Petzold, Matthias
Published in Microsystem technologies : sensors, actuators, systems integration (01.05.2013)
Published in Microsystem technologies : sensors, actuators, systems integration (01.05.2013)
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Journal Article
Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy : WaferBond'11, International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration
NAUMANN, Falk, BRAND, Sebastian, BERNASCH, Michael, TISMER, Sebastian, CZURRATIS, Peter, WÜNSCH, Dirk, PETZOLD, Matthias
Published in Microsystem technologies : sensors, actuators, systems integration (2013)
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Published in Microsystem technologies : sensors, actuators, systems integration (2013)
Journal Article
Silver Bonding Wire - An Alternative for Mechanical Sensitive Chip Configurations in Automotive Electronics Packaging
Klengel, Robert, Klengel, Sandy, Tismer, Sebastian, Araki, Noritoshi, Eto, Motoki, Haibara, Teruo, Yamada, Takashi, Feldmann, Jochen, Scheer, Achim, Binner, Ralph, Peters, Henk
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
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Conference Proceeding
Comprehensive Study of Long-Term Reliability of Copper Bonding Wires at Harsh Automotive Conditions
Klengel, Robert, Klengel, Sandy, Tismer, Sebastian, Ackermann, Thomas, Araki, Noritoshi, Eto, Motoki, Haibara, Teruo, Yamada, Takashi, Feldmann, Jochen, Binner, Ralph, Peters, Henk, Scheer, Achim, Chee, Vincent
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Acoustic imaging of bump defects in flip-chip devices using split spectrum analysis
Tismer, Sebastian, Brand, Sebastian, Klengel, Sandy, Petzold, Matthias, Czurratis, Peter
Published in 2013 IEEE International Ultrasonics Symposium (IUS) (01.07.2013)
Published in 2013 IEEE International Ultrasonics Symposium (IUS) (01.07.2013)
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Conference Proceeding