by Boehme, Bjoern, Breuer, Dirk, Goetze, Christian, Estoque, Al Rhea, Tischer, Falk, Kuechenmeister, Frank, Paul, Jens, Thiele, Michael
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)

by TISCHER FALK, WACHTLER AXEL, KUEHN INGO, ECKHARDT UWE
Year of Publication 19.08.2014

by TISCHER, FALK, ECKHARDT, UWE, WACHTLER, AXEL, KUEHN, INGO
Year of Publication 22.04.2010

by Baer, Matthias, Tischer, Falk, Goetting, Oliver, Schlegel, Peer
Year of Publication 02.12.2008

by TISCHER FALK, SCHLEGEL PEER, GOETTING OLIVER, BAER MATTHIAS
Year of Publication 02.12.2008

by TISCHER FALK, SCHLEGEL PEER, GOETTING OLIVER, BAER MATTHIAS
Year of Publication 02.03.2006

by TISCHER FALK, WACHTLER AXEL, KUEHN INGO, ECKHARDT UWE
Year of Publication 04.08.2005

by SCHLEGEL, PEER, TISCHER, FALK, GOETTING, OLIVER, BAER, MATTHIAS
Year of Publication 09.03.2006

by TISCHER, FALK, ECKHARDT, UWE, WACHTLER, AXEL, KUEHN, INGO
Year of Publication 13.10.2005