Study on melt properties, microstructure, tensile properties of low Ag content Sn–Ag–Zn Lead-free solders
Luo, Tingbi, Chen, Zhuo, Hu, Anmin, Li, Ming
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (30.10.2012)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (30.10.2012)
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Journal Article
Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution
Hu, Jing, Luo, Tingbi, Hu, Anmin, Li, Ming, Mao, Dali
Published in Journal of electronic materials (01.07.2011)
Published in Journal of electronic materials (01.07.2011)
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Journal Article
Formation and growth of interfacial intermetallic layers of Sn–8Zn–3Bi–0.3Cr on Cu, Ni and Ni–W substrates
Liang, Jiaxing, Luo, Tingbi, Hu, Anmin, Li, Ming
Published in Microelectronics and reliability (01.01.2014)
Published in Microelectronics and reliability (01.01.2014)
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Journal Article
Study on low-Ag content Sn–Ag–Zn/Cu solder joints
Luo, Tingbi, Chen, Zhuo, Hu, Anmin, Li, Ming, Li, Peng
Published in Microelectronics and reliability (01.12.2013)
Published in Microelectronics and reliability (01.12.2013)
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Journal Article
Microstructure and mechanical properties of Sn–Zn–Bi–Cr lead-free solder
Luo, Tingbi, Hu, Anmin, Hu, Jing, Li, Ming, Mao, Dali
Published in Microelectronics and reliability (01.03.2012)
Published in Microelectronics and reliability (01.03.2012)
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Journal Article
Interfacial reaction of Sn–2.0Ag–2.5Zn solder on Cu and Ni–W substrates
Liu, Yucheng, Hu, Anmin, Luo, Tingbi, Li, Ming
Published in Journal of materials science. Materials in electronics (01.03.2013)
Published in Journal of materials science. Materials in electronics (01.03.2013)
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Journal Article
Effect of Cr additions on interfacial reaction between the Sn–Zn–Bi solder and Cu/electroplated Ni substrates
Bi, Jinglin, Hu, Anmin, Hu, Jing, Luo, Tingbi, Li, Ming, Mao, Dali
Published in Microelectronics and reliability (01.03.2011)
Published in Microelectronics and reliability (01.03.2011)
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Journal Article
Effect of Zr doping on LiNi0.5Mn1.5O4 with ordered or disordered structures
Feng, Shaoping, Kong, Xin, Sun, Hongyan, Wang, Baosen, Luo, Tingbi, Liu, Guiyang
Published in Journal of alloys and compounds (15.06.2018)
Published in Journal of alloys and compounds (15.06.2018)
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Journal Article
LiNi0.5Mn1.45Zn0.05O4 with Excellent Electrochemical Performance for Lithium Ion Batteries
Sun, Hongyan, Kong, Xin, Wang, Baosen, Luo, Tingbi, Liu, Guiyang
Published in International journal of electrochemical science (01.09.2017)
Published in International journal of electrochemical science (01.09.2017)
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Journal Article
Effect of Zr doping on LiNi^sub 0.5^Mn^sub 1.5^O^sub 4^ with ordered or disordered structures
Feng, Shaoping, Kong, Xin, Sun, Hongyan, Wang, Baosen, Luo, Tingbi, Liu, Guiyang
Published in Journal of alloys and compounds (15.06.2018)
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Published in Journal of alloys and compounds (15.06.2018)
Journal Article
3D Porous LiNi0.5Mn1.5O4 with Improved Rate Capability and Cycle Stability
Feng, Shaoping, Kong, Xin, Sun, Hongyan, Wang, Baosen, Luo, Tingbi, Liu, Guiyang
Published in International journal of electrochemical science (01.05.2018)
Published in International journal of electrochemical science (01.05.2018)
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Journal Article
Template Synthesis of Highly Dispersed LiNi0.5Mn1.5O4 Thin Flakes with Improved Electrochemical Performance using Filter Paper
Sun, Hongyan, Kong, Xin, Wang, Baosen, Luo, Tingbi, He, Ying, Liu, Guiyang
Published in International journal of electrochemical science (01.05.2018)
Published in International journal of electrochemical science (01.05.2018)
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Journal Article
Formation and growth of intermetallic compounds of Sn-2Ag-2.5Zn on Cu and Ni substrates
Yucheng Liu, Tingbi Luo, Anmin Hu, Shangyuan Li, Weizhen Wang, Ming Li
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding
Study on properties of low-Ag content Sn-Ag-Zn lead-free solders
Tingbi Luo, Xi Chen, Jing Hu, Anmin Hu, Ming Li
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding
Studies on microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder
Tingbi Luo, Anmin Hu, Ming Li, Dali Mao
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
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Conference Proceeding
Low-Temperature Solid State Bonding of Sn and Nickel Micro Cones for Micro Interconnection
Chen, Zhuo, Luo, Tingbi, Hang, Tao, Li, Ming, Hu, Anmin
Published in ECS solid state letters (01.01.2012)
Published in ECS solid state letters (01.01.2012)
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Journal Article