Microwave Transmission Line Design Across Split Reference Planes
Berge, L., Doyle, M., Timpane, T., Bjorgaard, J.
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
Get full text
Conference Proceeding
Low-Loss Flex Circuit Interconnect: Development of Reduced Insertion-Loss Flexible Packaging
Doyle, M.S., Martin, W., Pease, D., Timpane, T.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Get full text
Conference Proceeding
Xbox360 Front Side Bus - A 21.6 GB/s End-to-End Interface Design
Siljenberg, D., Baumgartner, S., Buchholtz, T., Maxson, M., Timpane, T., Johnson, J.
Published in 2007 Asia and South Pacific Design Automation Conference (01.01.2007)
Published in 2007 Asia and South Pacific Design Automation Conference (01.01.2007)
Get full text
Conference Proceeding
Maintaining System Signal and Power Integrity Characteristics as Part of a Module Cost-Reduction Exercise
Dahlen, P.E., Timpane, T., Becker, D.J., Liang, T.W., Martin, W.D., Rudrud, P., Bartley, G.K.
Published in 2007 IEEE Electrical Performance of Electronic Packaging (01.10.2007)
Published in 2007 IEEE Electrical Performance of Electronic Packaging (01.10.2007)
Get full text
Conference Proceeding
Xbox360® Front Side Bus Development
Maxson, M., Fox, B., Timpane, T., Hartley, J., Becker, D., Maki, A.
Published in 2006 IEEE Workship on Signal Propagation on Interconnects (01.05.2006)
Published in 2006 IEEE Workship on Signal Propagation on Interconnects (01.05.2006)
Get full text
Conference Proceeding
Evaluation of frequency-dependent transmission line model extraction methods based on laboratory measurements
Syverson, S.L., Heckmann, D.L., Timpane, T.J., Dahlen, P.E.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Get full text
Conference Proceeding
양자회로들의 열 절연을 위한 접지 전도체 분리
TIMPANE TREVOR, BERGE LAYNE, HART SEAN, LARSEN CURTIS EUGENE, GOOD MICHAEL, GUMANN PATRYK
Year of Publication 05.06.2023
Get full text
Year of Publication 05.06.2023
Patent