The Best EMC Mold Flow Behavior Simulation by Spiral Flow Benchmarking
Chen, Xi Hong, Tien Yen, Chin, Yang, Yu Ting, Ling Ma, Wei, Tseng, Yi-Hsiu, Hsu, Chih Chung
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Get full text
Conference Proceeding
Thermally-enhanced semiconductor 3d package-on-package stacked device
YEN, CHIN TIEN, TSENG, CHI SHENG, CHOU, CHIEN WEI, CHUANG, YONG CHENG
Year of Publication 21.12.2016
Get full text
Year of Publication 21.12.2016
Patent