Ultrafast Zinc-Ion Diffusion Ability Observed in 6.0-Nanometer Spinel Nanodots
Jiang, Le, Wu, Zeyi, Wang, Yanan, Tian, Wenchao, Yi, Zhiying, Cai, Cailing, Jiang, Yingchang, Hu, Linfeng
Published in ACS nano (24.09.2019)
Published in ACS nano (24.09.2019)
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Journal Article
Surface roughness analysis of Cu films deposited on Si substrates: A molecular dynamic analysis
Chen, Zhiqiang, Cao, Yunqi, Tian, Wenchao, Wang, Yongkun
Published in Journal of applied physics (28.07.2019)
Published in Journal of applied physics (28.07.2019)
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Journal Article
The Study of the Reliability of Complex Components during the Electromigration Process
Cui, Hao, Tian, Wenchao, Zhang, Yiming, Chen, Zhiqiang
Published in Micromachines (Basel) (21.02.2023)
Published in Micromachines (Basel) (21.02.2023)
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Journal Article
Oxygen vacancy migration and its lattice structural origin in A-site non-stoichiometric bismuth sodium titanate perovskites
Shi, Jing, Liu, Xiao, Zhu, Fangyuan, Tian, Wenchao, Xia, Yuanhua, Li, Tangyuan, Rao, Rongrong, Zhang, Tao, Liu, Laijun
Published in Journal of Materiomics (01.05.2022)
Published in Journal of Materiomics (01.05.2022)
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Journal Article
Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature Cycling
Tian, Wenchao, Dang, Haojie, Li, Dexin, Cong, Yunhao, Chen, Yuanming
Published in Micromachines (Basel) (30.07.2024)
Published in Micromachines (Basel) (30.07.2024)
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Journal Article
Delamination of Plasticized Devices in Dynamic Service Environments
Tian, Wenchao, Chen, Xuyang, Zhang, Guoguang, Chen, Yuanming, Luo, Jijun
Published in Micromachines (Basel) (11.03.2024)
Published in Micromachines (Basel) (11.03.2024)
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Journal Article
A Review of the Characteristics, Synthesis, and Thermodynamics of Type-II Weyl Semimetal WTe2
Tian, Wenchao, Yu, Wenbo, Liu, Xiaohan, Wang, Yongkun, Shi, Jing
Published in Materials (01.07.2018)
Published in Materials (01.07.2018)
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Journal Article
Temperature Cycle Reliability Analysis of an FBAR Filter-Bonded Ceramic Package
Tian, Wenchao, Li, Wenbin, Zhang, Shuaiqi, Zhou, Liming, Wang, Heng
Published in Micromachines (Basel) (01.11.2023)
Published in Micromachines (Basel) (01.11.2023)
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Journal Article
Three-Dimensional Integrated Fan-Out Wafer-Level Package Micro-Bump Electromigration Study
Tian, Wenchao, Gao, Ran, Gu, Lin, Ji, Haoyue, Zhou, Liming
Published in Micromachines (Basel) (15.06.2023)
Published in Micromachines (Basel) (15.06.2023)
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Journal Article