Aging Mechanism and Lifetime Prediction of Glass Fiber Reinforced Liquid Crystal Polymer Composite under Thermal and Oxidative Conditions
Liu, Peijiang, Li, Yinle, Xu, Huanxiang, Tian, Wanchun, Zhao, Zhenbo, Liu, Yao, Zhao, Hao, Sun, Zhaoning, Wu, Jianyu, Xu, Liguo
Published in Macromolecular materials and engineering (01.03.2024)
Published in Macromolecular materials and engineering (01.03.2024)
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Journal Article
Failure Analysis Technology of Lead-free BGA Solder Joints and Relevant Cases
Wanchun, Tian, Qin, Wu, Liang, Zhou
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
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Conference Proceeding
Failure analysis of multilayer ceramic capacitor board level interconnect caused by monotonic bending stress
Hongqin Wang, Chaohui Liang, Tao Lu, Hui Xiao, Wanchun Tian
Published in 2016 11th International Conference on Reliability, Maintainability and Safety (ICRMS) (01.10.2016)
Published in 2016 11th International Conference on Reliability, Maintainability and Safety (ICRMS) (01.10.2016)
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Conference Proceeding
Test procedure of indoor lighting LED luminaires based on step-stress accelerated degradation test
Wanchun Tian, Miao Cai, Weihai Zhang, Kunmiao Tian, Ping Zhang, Xianping Chen, Daoguo Yang
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
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Conference Proceeding
Thermal design and analysis of high power LED with LTCC packaging
Yang Hai, Daoguo Yang, Dejin Yan, Wanchun Tian
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding
The simulation analysis of LED luminaires for indoor lighting
Wanchun Tian, Daoguo Yang, Miao Cai, Zhen Zhang, Ming Gong, Yu Yang
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding
Detection of Borrelia burgdorferi from ticks (Acari) in Hebei Province, China
Tian, W. (Centers for Public Health and Disease Control of Hebei Province, Baoding, China.), Zhang, Z, Moldenhauer, S, Guo, Y, Yu, Q, Wang, L, Chen, M
Published in Journal of medical entomology (01.03.1998)
Published in Journal of medical entomology (01.03.1998)
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Journal Article
Research on the Application of Microscopic Analysis Technology in PCB Inspection and Failure Analysis
Chen, Zhenhai, Li, Xingxing, Zhou, Bo, He, Xiao, Tian, Wanchun
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
Application of strain test technology in PCBA process
Wanchun, Tian, Hui, Xu, Chaohui, Liang
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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Conference Proceeding
Reliability Evaluation and Case Analysis of Leadless Ceramic Chip Carrier Devices
Tian, Wanchun, Cui, Meilun, Du, Liu, Zhong, Bin, Wu, Mouzhi, Ai, Jing
Published in 2023 14th International Conference on Reliability, Maintainability and Safety (ICRMS) (26.08.2023)
Published in 2023 14th International Conference on Reliability, Maintainability and Safety (ICRMS) (26.08.2023)
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Conference Proceeding
Strain Threshold Test and Case Analysis of THT Component
Tian, Wanchun, Wang, Shiyu, Liu, Peijiang, Liu, Jiahao, Wu, Jingxi, Zhao, Hao
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
A Survey of Probabilistic Search Based on Bayesian Framework
Yu, Liang, Han, Qiang, Tuo, Xianguo, Tian, Wanchun
Published in 2019 4th International Conference on Mechanical, Control and Computer Engineering (ICMCCE) (01.10.2019)
Published in 2019 4th International Conference on Mechanical, Control and Computer Engineering (ICMCCE) (01.10.2019)
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Conference Proceeding