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"Thurairajaratnam, Aritharan"
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"Thurairajaratnam, Aritharan"
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A Novel Vertical Conductive Structure for Printed Circuit Boards and its Scalable Model
by
Park, Junyong
,
Li, Chaofeng
,
Mok, Eddie
,
Dickson, Joe
,
Tourne, Joan
,
Thurairajaratnam
,
Aritharan
,
Kim, DongHyun
Published in
IEEE transactions on signal and power integrity
(2024)
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Multiple layer printed circuit board with unplated vias
by
SENK DAVID
,
THURAIRAJARATNAM ARITHARAN
Year of Publication
18.11.2014
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MULTIPLE LAYER PRINTED CIRCUIT BOARD
by
SENK DAVID
,
THURAIRAJARATNAM ARITHARAN
Year of Publication
25.04.2013
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Semiconductor package having discrete non-active electrical components incorporated into the package
by
MILLER LEAH
,
THURAIRAJARATNAM ARITHARAN
Year of Publication
07.09.2010
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Semiconductor package having discrete non-active electrical components incorporated into the package
by
Miller, Leah
,
Thurairajaratnam
,
Aritharan
Year of Publication
07.09.2010
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Semiconductor package having dicrete non-active electrical components incorporated into the package
by
MILLER LEAH
,
THURAIRAJARATNAM ARITHARAN
Year of Publication
05.05.2005
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Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
by
BARBER IVOR
,
MILLER LEAH
,
THURAIRAJARATNAM ARITHARAN
Year of Publication
09.11.2010
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Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
by
Miller, Leah
,
Barber, Ivor
,
Thurairajaratnam
,
Aritharan
Year of Publication
09.11.2010
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Substrate impedance measurement
by
Nagar, Mohan
,
Thurairajaratnam
,
Aritharan
Year of Publication
26.08.2004
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Controlled impedance for wire bonding interconnects
by
Thurairajaratnam
,
Aritharan
,
Ranganathan, Ramaswamy
Year of Publication
15.04.2004
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Controlled impedance for wire bonding interconnects
by
RANGANATHAN RAMASWAMY
,
THURAIRAJARATNAM ARITHARAN
Year of Publication
15.04.2004
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SUBSTRATE IMPEDANCE MEASUREMENT
by
Thurairajaratnam
,
Aritharan
,
Nagar, Mohan
Year of Publication
15.04.2004
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Transmission equalization system and an integrated circuit package employing the same
by
Govind, Anand
,
Thurairajaratnam
,
Aritharan
Year of Publication
17.12.2002
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Transmission equalization system and an integrated circuit package employing the same
by
GOVIND ANAND
,
THURAIRAJARATNAM ARITHARAN
Year of Publication
17.12.2002
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Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
by
BARBER IVOR
,
MILLER LEAH
,
THURAIRAJARATNAM ARITHARAN
Year of Publication
24.03.2009
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Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
by
Miller, Leah
,
Barber, Ivor
,
Thurairajaratnam
,
Aritharan
Year of Publication
24.03.2009
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Functionality based package design for integrated circuit blocks
by
THURAIRAJARATNAM ARITHARAN
,
HALL JEFFREY A
Year of Publication
04.04.2006
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Functionality based package design for integrated circuit blocks
by
Hall, Jeffrey A
,
Thurairajaratnam
,
Aritharan
Year of Publication
04.04.2006
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Single reference plane plastic ball grid array package
by
Juneja, Nitin
,
Thurairajaratnam
,
Aritharan
Year of Publication
28.05.2002
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Single reference plane plastic ball grid array package
by
JUNEJA NITIN
,
THURAIRAJARATNAM ARITHARAN
Year of Publication
28.05.2002
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