Search Results - "Thomas Uhrmann" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage

by Iacovo, Serena, D'have, Koen, Okudur, Oguzhan Orkut, De Vos, Joeri, Uhrmann, Thomas, Plach, Thomas, Conard, Thierry, Meersschaut, Johan, Bex, Pieter, Brems, Steven, Phommahaxay, Alain, Gonzalez, Mario, Witters, Liesbeth, Beyer, Gerald, Beyne, Eric
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)

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Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

by Iacovo, Serena, Peng, Lan, Nagano, Fuya, Uhrmann, Thomas, Burggraf, Jurgen, Fehkuhrer, Andreas, Conard, Thierry, Inoue, Fumihiro, Kim, Soon-Wook, De Vos, Joeri, Phommahaxay, Alain, Beyne, Eric
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)

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Collective Die Bonding: An Enabling Toolkit for Heterogeneous Integration

Collective Die Bonding: An Enabling Toolkit for Heterogeneous Integration

by Burggraf, Jürgen, Uhrmann, Thomas, Pires, Mariana
Published in ECS transactions (08.09.2020)

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Journal Article

Influencing factors in high precision fusion wafer bonding for monolithic integration

Influencing factors in high precision fusion wafer bonding for monolithic integration

by Uhrmann, Thomas, Kurz, Florian, Plach, Thomas, Wagenleitner, Thomas, Dragoi, Viorel, Wimplinger, Markus, Lindner, Paul
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)

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TEM Study on Diffusion Process of NiFe Schottky and MgO/NiFe Tunneling Diodes for Spin Injection in Silicon

TEM Study on Diffusion Process of NiFe Schottky and MgO/NiFe Tunneling Diodes for Spin Injection in Silicon

by Jehyun Lee, Uhrmann, Thomas, Dimopoulos, Theodoros, Bruckl, Hubert, Fidler, Josef
Published in IEEE transactions on magnetics (01.06.2010)

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Monolithic IC integration key alignment aspects for high process yield

Monolithic IC integration key alignment aspects for high process yield

by Uhrmann, Thomas, Wagenleitner, Thomas, Glinsner, Thomas, Wimplinger, Markus, Lindner, Paul
Published in 2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (01.10.2014)

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Novel Inorganic IR Release Process for High Temperature W2W and D2W Integration

Novel Inorganic IR Release Process for High Temperature W2W and D2W Integration

by Urban, Peter, Povazay, Boris, Uhrmann, Thomas, Gruber, Michael Josef, Thallner, Bernd, Wimplinger, Markus
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)

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Collective Die Bonding: An Enabling Toolkit for Heterogeneous Integration

Collective Die Bonding: An Enabling Toolkit for Heterogeneous Integration

by Burggraf, Jurgen, Uhrmann, Thomas, Pires, Mariana
Published in Meeting abstracts (Electrochemical Society) (23.11.2020)

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Journal Article

Wafer Bonding for Backside Illuminated Image Sensors

Wafer Bonding for Backside Illuminated Image Sensors

by Matthias, Thorsten, Uhrmann, Thomas, Dragoi, Viorel, Wagenleitner, Thomas, Lindner, Paul
Published in ECS transactions (16.03.2012)

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Journal Article

IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism

IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism

by Chancerel, Francois, Urban, Peter, Slabbekoorn, John, Halas, Simon, Bravin, Julian, Brems, Steven, Uhrmann, Thomas, Wimplinger, Markus, Phommahaxay, Alain, Beyne, Eric
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)

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Development of UV-curable molding materials with minimum die-shift for FOWLP/FOPLP

Development of UV-curable molding materials with minimum die-shift for FOWLP/FOPLP

by Schindler, Markus, Ringelstetter, Severin, Pires, Mariana, Begel, Mikhail, Kneidinger, Andrea, Kleinpotzl, Florian, Uhrmann, Thomas, Wimplinger, Markus, Brandl, Elisabeth
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)

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0.5 ¼m Pitch Wafer-to-wafer Hybrid Bonding with SiCN Bonding Interface for Advanced Memory

0.5 ¼m Pitch Wafer-to-wafer Hybrid Bonding with SiCN Bonding Interface for Advanced Memory

by Ma, Kai, Bekiaris, Nikolaos, Ramaswami, Sesh, Ding, Taotao, Probst, Gernot, Burggraf, Jurgen, Uhrmann, Thomas
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)

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Heterogeneous Integration by Collective Die-To-Wafer Bonding

Heterogeneous Integration by Collective Die-To-Wafer Bonding

by Uhrmann, Thomas, Burggraf, Jurgen, Eibelhuber, Martin
Published in 2018 International Wafer Level Packaging Conference (IWLPC) (01.10.2018)

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0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatures with SiCN Bond Layer

0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatures with SiCN Bond Layer

by Ma, Kai, Bekiaris, Nikolaos, Hsu, Ching-Hsiang, Xue, Lei, Ramaswami, Sesh, Ding, Taotao, Probst, Gernot, Wernicke, Tobias, Uhrmann, Thomas, Wimplinger, Markus
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)

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Ultra High Density RDL Patterning of High-Resolution Dielectrics by Maskless Exposure Technology for High Performance Computing and Artificial Intelligence

Ultra High Density RDL Patterning of High-Resolution Dielectrics by Maskless Exposure Technology for High Performance Computing and Artificial Intelligence

by Varga, Ksenija, Uhrmann, Thomas, Holly, Roman, Zenger, Tobias, Povazay, Boris, Janssen, Dimitri, van Herck, Niels, Reybrouck, Mario, Vandevyvere, Marieke, Malik, Sanjay, Vanclooster, Stefan
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)

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METHOD AND DEVICE FOR THE PRODUCTION AND PROVISION OF ELECTRONIC COMPONENTS

METHOD AND DEVICE FOR THE PRODUCTION AND PROVISION OF ELECTRONIC COMPONENTS

by LINDNER, Friedrich, Paul, WIMPLINGER, Markus, UHRMANN, Thomas, BURGGRAF, Jürgen
Year of Publication 28.08.2024

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Patent

Device and method for separating a temporarily bonded substrate stack

Device and method for separating a temporarily bonded substrate stack

by Povazay, Boris, Uhrmann, Thomas, Brandl, Elisabeth
Year of Publication 27.12.2022

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Patent

METHOD AND DEVICE FOR EXPOSING A PHOTOSENSITIVE COATING

METHOD AND DEVICE FOR EXPOSING A PHOTOSENSITIVE COATING

by ZENGER, Tobias, POVAZAY, Boris, THALLNER, Bernhard, UHRMANN, Thomas
Year of Publication 07.08.2024

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Patent

METHOD FOR SEPARATING A FIRST SUBSTRATE LAYER, DEVICE FOR CARRYING OUT SUCH SEPARATING, AND SUBSTRATE COMPRISING A FIRST SUBSTRATE LAYER

METHOD FOR SEPARATING A FIRST SUBSTRATE LAYER, DEVICE FOR CARRYING OUT SUCH SEPARATING, AND SUBSTRATE COMPRISING A FIRST SUBSTRATE LAYER

by UHRMANN, Thomas, BURGGRAF, Jürgen
Year of Publication 23.05.2024

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Patent

Aggressive Pitch Scaling (sub-0.5 μm) of W2W Hybrid Bonding Through Process Innovations

Aggressive Pitch Scaling (sub-0.5 μm) of W2W Hybrid Bonding Through Process Innovations

by Sherwood, Tyler, Patlolla, Raghuveer, Salfelder, Joe, Kasbauer, Thomas, Sreenivasan, Raghav, Li, Kun, Ley, Ryan, Probst, Gernot, Appell, Jason, Ahn, Ki Cheol, Gorchichko, Masha, Uhrmann, Thomas
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)

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